Features: • Low VCE (on) Non Punch Through IGBT Technology.• 10µs Short Circuit Capability.• Square RBSOA.• Positive VCE (on) Temperature Coefficient.• Maximum Junction Temperature rated at 175°C.Specifications Parameter Max. Units VCES Collector-t...
IRGSL30B60K: Features: • Low VCE (on) Non Punch Through IGBT Technology.• 10µs Short Circuit Capability.• Square RBSOA.• Positive VCE (on) Temperature Coefficient.• Maximum Ju...
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Features: • Low VCE (on) Non Punch Through IGBT Technology.• Low Diode VF.• 10&m...
Parameter | Max. | Units | |
VCES | Collector-to-Emitter Voltage | 600 | V |
IC @ TC = 25°C | Continuous Collector Current | 78 | A |
IC @ TC = 100°C | Continuous Collector Current | 50 | |
ICM | Pulse Collector Current(Ref.Fig.C.T.5) | 120 | |
ILM | Clamped Inductive Load current | 120 | |
VISOL | RMS Isolation Voltage, Terminal to Case, t=1 min. | 2500 | V |
VGE | Gate-to-Emitter Voltage | ±20 | |
PD @ TC = 25°C | Maximum Power Dissipation | 370 | W |
PD @ TC = 100°C | Maximum Power Dissipation | 180 | |
TJ TSTG |
Operating Junction and Storage Temperature Range | -55 to +175 | °C |
Soldering Temperature, for 10 sec. | 300(0.063 in.(1.6mm)fromcase) | ||
Mounting Torque, 6-32 or M3 Screw | 10 lbf`in (1.1 N`m) |