Features: • Low VCE (on) Non Punch Through IGBT Technology.• Low Diode VF.• 10µs Short Circuit Capability.• Square RBSOA.• Ultrasoft Diode Reverse Recovery Characteristics.• Positive VCE (on) Temperature Coefficient.Application• Benchmark Efficiency ...
IRGSL10B60KD: Features: • Low VCE (on) Non Punch Through IGBT Technology.• Low Diode VF.• 10µs Short Circuit Capability.• Square RBSOA.• Ultrasoft Diode Reverse Recovery Charac...
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Features: • Low VCE (on) Non Punch Through IGBT Technology.• Low Diode VF.• 10&m...
Parameter | Max. | Units | |
VCES | Collector-to-Emitter Voltage | 600 | V |
IF@ TC= 25° | CContinuous Collector Current | 22 | A |
IF@ TC= 100° | CContinuous Collector Current | 12 | A |
ICM | Pulsed Collector Current | 44 | A |
ICM | Clamped Inductive Load Current | 44 | A |
IF@ TC= 25° | CDiode Continuous Forward Current | 22 | A |
IF@ TC= 100° | CDiode Continuous Forward Current | 10 | A |
LSM | Diode Maximum Forward Current | 44 | A |
VGE | Gate-to-Emitter Voltage | ± 20 | V |
PD@ TC= 25° | CMaximum Power Dissipation | 156 | W |
PD@ TC= 100° | CMaximum Power Dissipation | 62 | W |
TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to +150 | °C |
Soldering Temperature, for 10 sec. | 300 (0.063 in. (1.6mm) from case) |
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
IRGSL10B60KD