Features: ·Advanced Trench IGBT Technology ·Optimized for Sustain and Energy Recovery circuits in PDP applications·Low VCE(on) and Energy per Pulse (EPULSE TM) for improved panel efficiency ·High repetitive peak current capability ·Lead Free packageSpecifications Parameter Max. Units V...
IRGI4065PbF: Features: ·Advanced Trench IGBT Technology ·Optimized for Sustain and Energy Recovery circuits in PDP applications·Low VCE(on) and Energy per Pulse (EPULSE TM) for improved panel efficiency ·High re...
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Features: · Advanced Trench IGBT Technology· Optimized for Sustain and Energy Recovery circuits in...
Parameter | Max. | Units | |
VGE | Gate-to-Emitter Voltage | 30 | V |
IC@TC = 25 |
Continuous Collector Current,VGE@15V |
18 | A |
IC@ TC = 100 |
CContinuous Collector,VGE@15V | 14 | |
IRP@TC = 25 |
Repetitive Peak Current |
170 | |
PD@ TC = 25 | Power Dissipation | 39 | W |
PD@ TC = 100 | Power Dissipation | 16 | |
Linear Derating Factor | 0.31 | W/ | |
T J TSTG |
Operating Junction and Storage Temperature Range |
-40 to + 150 | |
Soldering Temperature for 10 seconds | 300 | ||
Mounting Torque, 6-32 or M3 Screw | 10lb in (1.1N m) |
N |
This IGBT IRGI4065PbF is specifically designed for applications in Plasma Display Panels. The IRGI4065PbF utilizes advanced trench IGBT gy to achieve low VCE(on) and low EPULSE TM rating per silicon area which improve panel efficiency. Additional features re 150 operating junction temperature and high repetitive peak curren capability. The IRGI4065PbF features combine to make this IGBT a highly efficient, robust and reliable device for PDP applications.