Features: · Advanced Trench IGBT Technology· Optimized for Sustain and Energy Recovery circuits in PDP applications· Low VCE(on) and Energy per Pulse (EPULSE TM) for improved panel efficiency· High repetitive peak current capability· Lead Free packageSpecifications Parameter Max. Un...
IRGI4055PbF: Features: · Advanced Trench IGBT Technology· Optimized for Sustain and Energy Recovery circuits in PDP applications· Low VCE(on) and Energy per Pulse (EPULSE TM) for improved panel efficiency· High ...
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Parameter |
Max. |
Unit | |
VGE | Drain- Source Voltage |
±30 |
V |
ID @ TC= 25 | Continuous Drain Current, VGE @ 15V |
36 |
A |
ID @ TC= 100 | Continuous Drain Current, VGE @ 15V |
18 |
A |
IRP @ TC = 25 | Repetitive Peak Current |
220 |
A |
PD @TC= 25 | Power Dissipation |
46 |
W |
PD @TC= 100 | Power Dissipation |
19 |
W |
Linear Derating Factor |
0.37 |
W/ | |
TJ,TSTG | Junction and Storage Temperature Range |
-40 to + 175 |
|
Soldering Temperature, for 10 seconds (1.6mm from case) |
300 | ||
Mounting torque, 6-32 or M3 screw |
10lb`in (1.1N`m) |
N |
This IGBT IRGI4055PbF is specifically designed for applications in Plasma Display Panels. The IRGI4055PbF utilizes advanced trench IGBT technology to achieve low VCE(on) and low EPULSE TM rating per silicon area which improve panel efficiency. Additional features are 150 operating junction temperature and high repetitive peak current capability. These features combine to make this IGBT a highly efficient, robust and reliable device for PDP applications.