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IRFZ46S

Features: · Advanced Process Technology· Surface Mount (IRFZ46S)· Low-profile through-hole (IRFZ46L)· 175°C Operating Temperature· Fast SwitchingSpecifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current,VGS @ 10V 50 A ID @ TC = 100°C Continuous D...

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SeekIC No. : 004377637 Detail

IRFZ46S: Features: · Advanced Process Technology· Surface Mount (IRFZ46S)· Low-profile through-hole (IRFZ46L)· 175°C Operating Temperature· Fast SwitchingSpecifications Parameter Max. Units ...

IRFZ46S Data Sheet

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Part Number:
IRFZ46S
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

· Advanced Process Technology
· Surface Mount (IRFZ46S)
· Low-profile through-hole (IRFZ46L)
· 175°C Operating Temperature
· Fast Switching


Specifications

 
Parameter
Max.
Units
ID @ TC = 25°C
 Continuous Drain Current,VGS @ 10V
50
A
ID @ TC = 100°C
 Continuous Drain Current,VGS @ 10V
38
IDM
 Pulsed Drain Current
220
PD @TA = 25°C
 Power Dissipation
3.7
W
PD @TC = 25°C
 Power Dissipation
150
W
 Linear Derating Factor
1.0
W/°C
VGS
 Gate-to-Source Voltage
±20
V
EAS
 Single Pulse Avalanche Energy
81
mJ
dv/dt
 Peak Diode Recovery dv/dt
4.5
V/ns
TJ
TSTG
 Operating Junction and
Storage Temperature Range
-55to+175
°C
  Soldering Temperature, for 10 seconds
300 (1.6mm from case )
Thermal Resistance
 
Parameter
Typ.
Max.
Units
RJC Junction-to-Case
-
1.0
°C/W
RJA Junction-to-Ambient ( PCB Mounted,steady-state)**
-
40



Description

Third Generation HEXFETs from International Rectifier IRFZ46S utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRFZ46S design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2Pak IRFZ46S is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak IRFZ46S is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

The through-hole version (IRFZ46S) is available for lowprofile applications.




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