IRFZ46NLPBF

Resistance Drain-Source RDS (on) :
Configuration :
Maximum Operating Temperature :
Transistor Polarity : N-Channel
Mounting Style : Through Hole
Packaging : Tube
Gate-Source Breakdown Voltage : 20 V
Drain-Source Breakdown Voltage : 55 V
Package / Case : TO-262
Continuous Drain Current : 53 A


Features:

` Advanced Process Technology
`Surface Mount (IRFZ46NS)
`Low-profile through-hole (IRFZ46NL)
`175 Operating Temperatur
`Fast Switching
`Fully Avalanche Rated
`Lead-Free


Specifications

Parameter		Maximum	Units
ID @ TC=25	Continuous Drain Current,VGS @-10V	53	A
ID @ TC=100	Continuous Drain Current,VGS @-10V	37
IDM	Pulsed Drain Current	180
PD@ TA= 25	Power Dissipation	3.8	W
PD@ TC= 25	Power Dissipation	107
	Linear Derating Factor	0.71	W/
VGS	Gate-to-Source Voltage	±20	V
IAR	Avalanche Current	28	A
EAR	Repetitive Avalanche Energy	11	mJ
dv/dt	Peak Diode Recovery dv/dt	5.0	V/nS
Tj,TSTG	Operating Junction and Storage Temperature Range	-55 to 175
	Soldering Temperature, for 10 seconds	300 (1.6mm from case)

	Parameter	Typ	Max.	Units
RJC RJA	Junction-to-Case Junction-to-Ambient ( PCB Mounted,steady-state)**	- -	1.4 40	/W

Description

Advanced HEXFET^®  Power MOSFETs from International Rectifier IRFZ46NLPbF utilize advanced processing techniques to achieve extremely low on-resistance per silicon area.  This benefit, combined with the fast switching speed and ruggedized device IRFZ46NLPbF design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and
reliable device for use in a wide variety of applications.

The D²Pak IRFZ46NLPbF is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D²Pak IRFZ46NLPbF is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

The through-hole version (IRFZ46NLPbF) is available for low-profile applications.