IRFZ46L

Manufacturer: Vishay Siliconix
FET Type: MOSFET N-Channel, Metal Oxide
Transistor Type: -
Current - Collector (Ic) (Max): -
Voltage - Collector Emitter Breakdown (Max): -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Frequency - Transition: -
Mounting Type: Surface Mount
FET Feature: Standard
Vgs(th) (Max) @ Id: 4V @ 250µA
Series: HEXFET®
Drain to Source Voltage (Vdss): 50V
Current - Continuous Drain (Id) @ 25° C: 50A
Packaging: Tube
Power - Max: 3.7W
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Input Capacitance (Ciss) @ Vds: 1800pF @ 25V
Supplier Device Package: D2PAK
Gate Charge (Qg) @ Vgs: 66nC @ 10V
Rds On (Max) @ Id, Vgs: 24 mOhm @ 32A, 10V


Features:

· Advanced Process Technology
· Surface Mount (IRFZ46S)
· Low-profile through-hole (IRFZ46L)
· 175°C Operating Temperature
· Fast Switching


Specifications

	Parameter	Max.	Units
ID @ TC = 25°C	Continuous Drain Current,VGS @ 10V	50	A
ID @ TC = 100°C	Continuous Drain Current,VGS @ 10V	38
IDM	Pulsed Drain Current	220
PD @TA = 25°C	Power Dissipation	3.7	W
PD @TC = 25°C	Power Dissipation	150	W
	Linear Derating Factor	1.0	W/°C
VGS	Gate-to-Source Voltage	±20	V
EAS	Single Pulse Avalanche Energy	81	mJ
dv/dt	Peak Diode Recovery dv/dt	4.5	V/ns
TJ TSTG	Operating Junction and Storage Temperature Range	-55to+175	°C
	Soldering Temperature, for 10 seconds	300 (1.6mm from case )

Thermal Resistance

	Parameter	Typ.	Max.	Units
RJC	Junction-to-Case	-	1.0	°C/W
RJA	Junction-to-Ambient ( PCB Mounted,steady-state)**	-	40

Description

Third Generation HEXFETs from International Rectifier IRFZ46L utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRFZ46L design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D²Pak IRFZ46L is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D²Pak IRFZ46L is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

The through-hole version (IRFZ46L) is available for lowprofile applications.