MOSFET N-CH 60V 48A D2PAK
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Series: | HEXFET® | Manufacturer: | International Rectifier | ||
FET Type: | MOSFET N-Channel, Metal Oxide | Transistor Type: | - | ||
Gain : | 19.5 dB | Current - Collector (Ic) (Max): | - | ||
FET Feature: | Standard | Drain to Source Voltage (Vdss): | 60V | ||
Voltage - Collector Emitter Breakdown (Max): | - | Current - Continuous Drain (Id) @ 25° C: | 48A | ||
Vce Saturation (Max) @ Ib, Ic: | - | Current - Collector Cutoff (Max): | - | ||
Rds On (Max) @ Id, Vgs: | 23 mOhm @ 29A, 10V | DC Current Gain (hFE) (Min) @ Ic, Vce: | - | ||
Vgs(th) (Max) @ Id: | 4V @ 250µA | Gate Charge (Qg) @ Vgs: | 60nC @ 10V | ||
Frequency - Transition: | - | Input Capacitance (Ciss) @ Vds: | 1360pF @ 25V | ||
Power - Max: | 110W | Mounting Type: | Surface Mount | ||
Package / Case: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | Supplier Device Package: | D2PAK |
Parameter | Max. | Units | |
ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V | 48 | A |
ID @ TC = 100°C | Continuous Drain Current, VGS @ 10V | 34 | |
IDM | Pulsed Drain Current | 192 | |
PD @TC = 25°C | Power Dissipation | 110 | W |
Linear Derating Factor | 0.71 | W/°C | |
VGS | Gate-to-Source Voltage | ±20 | V |
EAS | Single Pulse Avalanche Energy | 220 | mJ |
IAR | Avalance Current | 29 | A |
EAR | Repetitive Avalanche Energy | 11 | mJ |
dv/dt | Peak Diode Recovery dv/dt | 5.0 | V/ns |
TJ Tstg |
Operating Junction and Storage Temperature Range |
-55 to +175 | °C |
Soldering Temperature, for 10 seconds | 300 (1.6mm from case ) | ||
Mounting torque, 6-32 or M3 srew | 10 lbf•in (1.1N•m) |
Fifth Generation HEXFETs from International Rectifier IRFZ44ES utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRFZ44ES design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The D2Pak IRFZ44ES is a surface mount power package capable of accommodating die sizes up to HEX-4. The IRFZ44ES provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak IRFZ44ES is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRFZ44ES) is available for low-profile applications.