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IRFZ24VL

Features: · Advanced Process Technology· Ultra Low On-Resistance· Dynamic dv/dt Rating· 175°C Operating Temperature· Fast Switching· Fully Avalanche Rated· Optimized for SMPS ApplicationsSpecifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 1...

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IRFZ24VL: Features: · Advanced Process Technology· Ultra Low On-Resistance· Dynamic dv/dt Rating· 175°C Operating Temperature· Fast Switching· Fully Avalanche Rated· Optimized for SMPS ApplicationsSpecificati...

IRFZ24VL Data Sheet

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Part Number:
IRFZ24VL
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

· Advanced Process Technology
· Ultra Low On-Resistance
· Dynamic dv/dt Rating
· 175°C Operating Temperature
· Fast Switching
· Fully Avalanche Rated
· Optimized for SMPS Applications


Specifications

 
Parameter
Max.
Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V
17
A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V
12
IDM Pulsed Drain Current
68
PD @TC = 25°C Power Dissipation
44
W
  Linear Derating Factor
0.29
W/°C
VGS Gate-to-Source Voltage
±20
V
IAR Avalanche Curren t
17
A
EAR Repetitive Avalanche Energy
4.4
mJ
dv/dt Peak Diode Recovery dv/dt
4.2
V/ns
TJ
TSTG		 Operating Junction and
Storage Temperature Range
-55 to + 175
°C
  Soldering Temperature, for 10 seconds
300 (1.6mm from case)
Thermal Resistance
 
Parameter
Typ.
Max.
Units
RJC Junction-to-Case
-
3.4
°C/W
RJA Junction-to-Ambient( PCB Mounted)**
-
40



Description

Advanced HEXFET® Power MOSFETs from International Rectifier IRFZ24VL utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRFZ24VL design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2Pak IRFZ24VL is a surface mount power package capable of accommodating die sizes up to HEX-4. The IRFZ24VL provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak IRFZ24VL is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

The through-hole version (IRFZ24VL) is available for low-profile applications.




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