IRFZ14S

MOSFET N-Chan 60V 10 Amp

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IRFZ14S Picture
SeekIC No. : 00166853 Detail

IRFZ14S: MOSFET N-Chan 60V 10 Amp

floor Price/Ceiling Price

Part Number:
IRFZ14S
Mfg:
Vishay/Siliconix
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 60 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 10 A
Resistance Drain-Source RDS (on) : 0.2 Ohms Configuration : Single
Maximum Operating Temperature : + 175 C Mounting Style : SMD/SMT
Package / Case : D2PAK Packaging : Tube    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : SMD/SMT
Package / Case : D2PAK
Packaging : Tube
Continuous Drain Current : 10 A
Drain-Source Breakdown Voltage : 60 V
Resistance Drain-Source RDS (on) : 0.2 Ohms


Features:

· Advanced Process Technology
· Surface Mount (IRFZ14S)
· Low-profile through-hole (IRFZ14L)
· 175°C Operating Temperature
· Fast Switching



Specifications

 
Parameter
Max.
Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V
10
A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V
7.2
IDM Pulsed Drain Current
40
PD @TA = 25°C Power Dissipation
3.7
W
PD @TC = 25°C Power Dissipation
43
W
  Linear Derating Factor
0.29
W/°C
VGS Gate-to-Source Voltage
±20
V
EAS Single Pulse Avalanche Energy
47
mJ
dv/dt Peak Diode Recovery dv/dt
4.5
V/ns
TJ
TSTG
Operating Junction and
Storage Temperature Range
-55 to + 175
°C
  Soldering Temperature, for 10 seconds
300 (1.6mm from case)
Thermal Resistance
 
Parameter
Typ.
Max.
Units
RJC Junction-to-Case
-
3.5
°C/W
RJA Junction-to-Ambient( PCB Mounted,steady-state)**
-
40



Description

Third Generation HEXFETs from International Rectifier IRFZ14S  utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRFZ14S design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2Pak IRFZ14S  is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak IRFZ14S  is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

The through-hole version (IRFZ14S ) is available for lowprofile applications.




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