Features: ·Improved Inductive Ruggedness·Rugged Polysilicon Gate Cell Structure·Fast Switching Times·Lower Input Capacitance·Improved Gate Charge·Extended Safe Operating Area·Improved High Temperature ReliabilitySpecifications Symbol Characteristic Value Units VDSS Drain-to-Source Volt...
IRFU410A: Features: ·Improved Inductive Ruggedness·Rugged Polysilicon Gate Cell Structure·Fast Switching Times·Lower Input Capacitance·Improved Gate Charge·Extended Safe Operating Area·Improved High Temperatu...
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Symbol | Characteristic | Value | Units |
VDSS | Drain-to-Source Voltage | 520 | V |
ID | Continuous Drain Current (TC=25) |
1.2 | A |
Continuous Drain Current (TC=100) |
0.8 | ||
IDM | Drain Current-Pulsed |
4.0 | A |
VGS | Gate-to-Source Voltage | ±20 | V |
EAS | Single Pulsed Avalanche Energy |
40 | mJ |
IAR | Avalanche Current |
1.2 | A |
EAR | Repetitive Avalanche Energy |
4.2 | mJ |
dv/dt | Peak Diode Recovery dv/dt |
3.5 | V/ns |
PD | Total Power Dissipation (TC=25 ) Linear Derating Factor |
42 0.33 |
W W/ |
TJ , TSTG | Operating Junction and Storage Temperature Range |
-55 to +150 | |
TL | Maximum Lead Temp. for Soldering Purposes, 1/8" from case for 5-seconds |
300 |