Features: Advanced Process TechnologyUltra Low On-Resistance175°C Operating TemperatureFast SwitchingRepetitive Avalanche Allowed up to TjmaxSpecifications Parameter Max. Units Continuous Drain Current, VGS @ 10V (Silicon Limited) ID @ VGS = 10V, TC = 25°C 45 A ...
IRFU2607Z: Features: Advanced Process TechnologyUltra Low On-Resistance175°C Operating TemperatureFast SwitchingRepetitive Avalanche Allowed up to TjmaxSpecifications Parameter Max. Units ...
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Parameter |
Max. |
Units | |
Continuous Drain Current, VGS @ 10V (Silicon Limited) |
ID @ VGS = 10V, TC = 25°C |
45 |
A
|
Continuous Drain Current, VGS @ 10V |
ID @ VGS = 10V, TC = 100°C |
32 | |
Continuous Drain Current, VGS @ 10V (Package Limited) |
IDM |
42 | |
Pulsed Drain Current |
PD @ TC = 25°±25 |
180 |
W |
Power Dissipation |
110 |
W/K ? | |
Linear Derating Factor |
VGS |
±20 |
V |
Gate-to-Source Voltage |
EAS |
750 |
mJmW |
Single Pulse Avalanche Energy |
EAR |
96g |
o C |
Single Pulse Avalanche Energy Tested Value |
dv/dt |
96 | |
Avalanche Current |
TJ TSTG |
See Fig.12a, 12b, 15, 16 | |
Repetitive Avalanche Energy |
|||
Mounting Torque, 6-32 or M3 screw |
10 lbfin (1.1Nm) |
g |
Specifically designed for Automotive applications of the IRFU2607Z, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low onresistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.