IRFR5305PBF

MOSFET

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IRFR5305PBF Picture
SeekIC No. : 00149937 Detail

IRFR5305PBF: MOSFET

floor Price/Ceiling Price

US $ .33~.92 / Piece | Get Latest Price
Part Number:
IRFR5305PBF
Mfg:
International Rectifier
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~25
  • 25~100
  • 100~250
  • Unit Price
  • $.92
  • $.56
  • $.39
  • $.33
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Quick Details

Transistor Polarity : P-Channel Drain-Source Breakdown Voltage : - 55 V
Gate-Source Breakdown Voltage : 20 V Continuous Drain Current : - 28 A
Resistance Drain-Source RDS (on) : 65 m Ohms Configuration : Single
Maximum Operating Temperature : + 175 C Mounting Style : SMD/SMT
Package / Case : DPAK Packaging : Tube    

Description

Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : SMD/SMT
Package / Case : DPAK
Transistor Polarity : P-Channel
Packaging : Tube
Gate-Source Breakdown Voltage : 20 V
Drain-Source Breakdown Voltage : - 55 V
Continuous Drain Current : - 28 A
Resistance Drain-Source RDS (on) : 65 m Ohms


Features:

· Ultra Low On-Resistance
· Surface Mount (IRFR5305)
· Straight Lead (IRFU5305)
· Advanced Process Technology
· Fast Switching
· Fully Avalanche Rated
· Lead-Free



Specifications

 
Parameter
Max.
Unit
ID @ TA = 25 Continuous Drain Current, VGS @ -10V
-31
A
ID @ TA= 70 Continuous Drain Current, VGS @ -10V
-22
A
IDM Pulsed Drain Current
-110
A
PD @TA = 25 Power Dissipation
110
W
PD @TA = 70 Power Dissipation
0.71
W/
  Linear Derating Factor
± 20
V
VGS Gate-to-Source Voltage
280
mJ
EAS Single Pulse Avalanche Energy
-16
A
IAR Avalanche Current
11
mJ
EAR Repetitive Avalanche Energy
-5.0
V/ns
TJ,TSTG Operating Junction and
Storage Temperature Range
-55 to + 175
  Soldering Temperature, for 10 seconds
300 (1.6mm from case )
  Mounting torque, 6-32 or M3 srew

10 lbf`in (1.1N`m)

 



Description

Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET® Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D-Pak of the IRFR5305PbF is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.




Parameters:

Technical/Catalog InformationIRFR5305PBF
VendorInternational Rectifier
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET PolarityP-Channel
Drain to Source Voltage (Vdss)55V
Current - Continuous Drain (Id) @ 25° C31A
Rds On (Max) @ Id, Vgs65 mOhm @ 16A, 10V
Input Capacitance (Ciss) @ Vds 1200pF @ 25V
Power - Max110W
PackagingTube
Gate Charge (Qg) @ Vgs63nC @ 10V
Package / CaseDPak,SC-63,TO-252 (2 leads+tab)
FET FeatureStandard
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names IRFR5305PBF
IRFR5305PBF



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