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IRFR/U120N

Application Surface Mount (IRFR120N)Straight Lead (IRFU120N)Advanced Process Technology Fast Switching Fully Avalanche RatedSpecifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 9.4 A ID @ TC = 100°C Continuous Drain Current, VGS @ 10V ...

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SeekIC No. : 004377320 Detail

IRFR/U120N: Application Surface Mount (IRFR120N)Straight Lead (IRFU120N)Advanced Process Technology Fast Switching Fully Avalanche RatedSpecifications Parameter Max. Units ID @ TC = 25°C Cont...

IRFR/U120N Data Sheet

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Part Number:
IRFR/U120N
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Application

Surface Mount (IRFR120N)
 Straight Lead (IRFU120N)
 Advanced Process Technology
Fast Switching
Fully Avalanche Rated


Specifications

Parameter
Max.
Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V
9.4
A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V
6.6
IDM Pulsed Drain Current
38
PD @TC = 25°C Power Dissipation
48
W
Linear Derating Factor
0.32
W/°C
VGS Gate-to-Source Voltage
± 20
V
EAS Single Pulse Avalanche Energy
91
mJ
IAR Avalanche Current
5.7
A
EAR Peak Diode Recovery dv/dt
5.0
mJ
dv/dt Peak Diode Recovery dv/dt
5.0
V/ns
TJ
TSTG		 Operating Junction and
Storage Temperature Range
-55 to + 175
°C
Soldering Temperature, for 10 seconds
300 (1.6mm from case )



Description

Fifth Generation HEXFETs of the IRFR/U120N from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.

The D-PAK of the IRFR/U120N is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for throughhole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.




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