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IRFR3411

Features: · Advanced Process Technology· Ultra Low On-Resistance· Dynamic dv/dt Rating· 175°C Operating Temperature· Fast Switching· Fully Avalanche RatedSpecifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 32 A ID @ TC = 100°C Continu...

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SeekIC No. : 004377360 Detail

IRFR3411: Features: · Advanced Process Technology· Ultra Low On-Resistance· Dynamic dv/dt Rating· 175°C Operating Temperature· Fast Switching· Fully Avalanche RatedSpecifications Parameter Max. ...

IRFR3411 Data Sheet

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Part Number:
IRFR3411
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

· Advanced Process Technology
· Ultra Low On-Resistance
· Dynamic dv/dt Rating
· 175°C Operating Temperature
· Fast Switching
· Fully Avalanche Rated


Specifications

 
Parameter
Max.
Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V
32
A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V
23
IDM Pulsed Drain Current
110
PD @TC = 25°C Power Dissipation
130
W
  Linear Derating Factor
0.83
W/°C
VGS Gate-to-Source Voltage
±20
V
IAR Avalanche Current
16
A
EAR Repetitive Avalanche Energy
13
mJ
dv/dt Peak Diode Recovery dv/dt
7.0
V/ns
TJ
TSTG		 Operating Junction and
Storage Temperature Range
-55to+175
°C
  Soldering Temperature, for 10 seconds
300(1.6mm from case )

Thermal Resistance

 
Parameter
Typ.
Max.
Units
RJC Junction-to-Case
-
1.2
°C/W
RJA Junction-to-Ambient (PCB mount) *
-
50
RJA Junction-to-Ambient
-
110



Description

Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area.This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D-Pak of the IRFR3411 is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead, I-Pak, version (IRFU series) is for throughhole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.




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