Specifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 42 A ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 29 IDM Pulsed Drain Current 170 PD @TC = 25°C Power Dissipation 110 W Linear Derating Factor 0.71 W/°C VGS ...
IRFR2407: Specifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 42 A ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 29 IDM Pulsed Drain Curre...
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Features: · Avalanche Rugged Technology· Rugged Gate Oxide Technology· Lower Input Capacitance· Im...
Application Surface Mount (IRFR120N)Straight Lead (IRFU120N)Advanced Process Technology Fast Switc...
Parameter |
Max. |
Units | |
ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V | 42 | A |
ID @ TC = 100°C | Continuous Drain Current, VGS @ 10V | 29 | |
IDM | Pulsed Drain Current | 170 | |
PD @TC = 25°C | Power Dissipation | 110 | W |
Linear Derating Factor | 0.71 | W/°C | |
VGS | Gate-to-Source Voltage | ±20 | V |
EAS | Single Pulse Avalanche Energy | 130 | mJ |
IAR | Avalanche Current | 25 | A |
EAR | Repetitive Avalanche Energy |
11 |
mJ |
dv/dt | Peak Diode Recovery dv/dt |
5.0 |
V/ns |
TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 175 | |
Soldering Temperature, for 10 seconds | 300 (1.6mm from case) | ||
Mounting torque, 6-32 or M3 screw. | 10 lbf`in (1.1N`m) |
Seventh Generation HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs of the IRFR2407 are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The D-Pak of the IRFR2407 is designed for surface mounting using vapor phase, infrared, or wave soldering techniques.The straight lead version (IRFU series) is for throughhole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.