MOSFET N-Chan 250V 3.8 Amp
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Features: · Avalanche Rugged Technology· Rugged Gate Oxide Technology· Lower Input Capacitance· Im...
Application Surface Mount (IRFR120N)Straight Lead (IRFU120N)Advanced Process Technology Fast Switc...
Transistor Polarity : | N-Channel | Drain-Source Breakdown Voltage : | 250 V | ||
Gate-Source Breakdown Voltage : | +/- 20 V | Continuous Drain Current : | 3.8 A | ||
Resistance Drain-Source RDS (on) : | 1.1 Ohms | Configuration : | Single | ||
Maximum Operating Temperature : | + 150 C | Mounting Style : | SMD/SMT | ||
Package / Case : | DPAK | Packaging : | Tube |
PARAMETER | SYMBOL | LIMIT | UNIT | ||
Drain-Source Voltage | VDS | 250 | V | ||
Gate-Source Voltage | VGS | ± 20 | |||
Continuous Drain Current | VGS at 10 V | TC = 25 °C | ID | 3.8 | A |
TC = 100 °C | 2.4 | ||||
Pulsed Drain Currenta | IDM | 15 | |||
Linear Derating Factor | 0.33 | W/°C | |||
Linear Derating Factor (PCB Mount)e | 0.020 | ||||
Single Pulse Avalanche Energyb | EAS | 130 | mJ | ||
Repetitive Avalanche Currenta | IAR | 3.8 | A | ||
Repetitive Avalanche Energya | EAR | 4.2 | mJ | ||
Maximum Power Dissipation (PCB Mount)e | TA = 25 °C | PD | 2.5 | W | |
Maximum Power Dissipation | TC = 25 °C | 42 | W | ||
Peak Diode Recovery dV/dtc | dV/dt | 4.8 | V/ns |
Third generation Power MOSFETs of IRFR224 form Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The DPAK is designed for surface mounting using vapor phase, infrared, or wave solderig techniques. The straight lead version (IRFU/SiHFU series) of IRFR224 is for through-hole mounting applications. Power dissipation levels up to 1.5 W are possible in typical surface mount applications.