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IRFP460AS

Application·SMPS, UPS, Welding and High Speed Power SwitchingSpecifications Parameter Max. Units ID @ TC=25°C Continuous Drain Current, VGS @ 10V 20 A ID @ TC=100°C Continuous Drain Current, VGS @ 10V 13 IDM Pulsed Drain Current 80 PD @TC = 25°C Power Di...

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SeekIC No. : 004377289 Detail

IRFP460AS: Application·SMPS, UPS, Welding and High Speed Power SwitchingSpecifications Parameter Max. Units ID @ TC=25°C Continuous Drain Current, VGS @ 10V 20 A ID @ TC=100°C Cont...

IRFP460AS Data Sheet

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Part Number:
IRFP460AS
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/13

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Product Details

Description



Application

· SMPS, UPS, Welding and High Speed Power Switching


Specifications

 
Parameter
Max.
Units
ID @ TC=25°C Continuous Drain Current, VGS @ 10V
20
A
ID @ TC=100°C Continuous Drain Current, VGS @ 10V
13
IDM Pulsed Drain Current
80
PD @TC = 25°C Power Dissipation
280
W
  Linear Derating Factor
2.2
W/°C
VGS Gate-to-Source Voltage
±30
V
dv/dt Peak Diode Recovery dv/dt
3.8
V/ns
TJ
TSTG		 Operating Junction and
Storage Temperature Range
-55to+150
°C
  Mounting torque, 6-32 or M3 screw.
10 lbf`in (1.1N`m)
  Maximum Reflow Temperature 230 (Time above 183 °C should not exceed 100s)

°C




Description

Third Generation HEXFET®s of the IRFP460AS from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The TO-247 package of the IRFP460AS is preferred for commercial-industrial applications where higher power levels preclude the use of TO-220 devices. The TO-247 is similar but superior to the earlier TO-218 package because of its isolated mounting hole. It also provides greater creepage distance between pins to meet the requirements of most safety specifications.

This plated and leadformed version of the TO-247 package allows the package to be surface mounted in an application.




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