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IRFNG40

Features: Avalanche Energy RatingDynamic dv/dt RatingSimple Drive RequirementsEase of ParallelingHermetically SealedSurface MountLight-weightSpecifications Parameter IRFNG40 Units ID @ VGS = 10V, TC = 25°C Continuous Drain Current 3.9 A ID @ VGS = 10V, TC = 100°C Continuous ...

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IRFNG40: Features: Avalanche Energy RatingDynamic dv/dt RatingSimple Drive RequirementsEase of ParallelingHermetically SealedSurface MountLight-weightSpecifications Parameter IRFNG40 Units ID @...

IRFNG40 Data Sheet

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Part Number:
IRFNG40
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

Avalanche Energy Rating
Dynamic dv/dt Rating
Simple Drive Requirements
Ease of Paralleling
Hermetically Sealed
Surface Mount
Light-weight


Specifications

  Parameter IRFNG40 Units
ID @ VGS = 10V, TC = 25°C Continuous Drain Current 3.9 A
ID @ VGS = 10V, TC = 100°C Continuous Drain Current 2.5
IDM Pulsed Drain Current 15.6
PD @ TC = 25°C Max. Power Dissipation 125 W
  Linear Derating Factor 1.0 W/K
VGS Gate-to-Source Voltage ±20 V
EAS Single Pulse Avalanche Energy 530 mJ
IAR Avalanche Current 3.9 A
EAR Repetitive Avalanche Energy 12.5 mJ
dv/dt Peak Diode Recovery dv/dt 1.0 V/ns
TJ
TSTG		 Operating Junction
Storage Temperature Range		 -55 to 150 oC
  Package Mounting Surface Temperature 300 (for 5 seconds)
  Weight 2.6 (typical) g




Description

HEXFET technology is the key to International Rectifier's advanced line of power MOSFET transis- tors IRFNG40. The efficient geometry achieves very low on-state resistance combined with high transconductance.HEXFET transistors also feature all of the well-es-tablish advantages of MOSFETs, such as voltage control, very fast switching, ease of paralleling and electrical parameter temperature stability.

They are well-suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers, and high energy pulse circuits. The Surface Mount Device (SMD-1) package repre- sents another step in the continual evolution of sur- face mount technology.

The SMD-1 IRFNG40 will give designers the extra flexibility they need to increase circuit board density. International Rectifier has en-gineered the SMD-1 package to meet the specific needs of the power market by increasing the size of the termination pads, thereby enhancing thermal and electrical performance.




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