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IRFN9240SMD

Features: • HERMETICALLY SEALED SURFACE MOUNT PACKAGE• SMALL FOOTPRINT EFFICIENT USE OF PCB SPACE.• SIMPLE DRIVE REQUIREMENTS• LIGHTWEIGHT• HIGH PACKING DENSITIESSpecifications VGS Gate Source VoltageID Continuous Drain Current (VGS =0 , Tcase = 25)ID Continuou...

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SeekIC No. : 004377225 Detail

IRFN9240SMD: Features: • HERMETICALLY SEALED SURFACE MOUNT PACKAGE• SMALL FOOTPRINT EFFICIENT USE OF PCB SPACE.• SIMPLE DRIVE REQUIREMENTS• LIGHTWEIGHT• HIGH PACKING DENSITIESSpeci...

IRFN9240SMD Data Sheet

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Part Number:
IRFN9240SMD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/22

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Product Details

Description



Features:

• HERMETICALLY SEALED SURFACE MOUNT PACKAGE
• SMALL FOOTPRINT EFFICIENT USE OF PCB SPACE.
• SIMPLE DRIVE REQUIREMENTS
• LIGHTWEIGHT
• HIGH PACKING DENSITIES


Specifications

VGS   Gate Source Voltage
ID      Continuous Drain Current (VGS =0 , Tcase = 25)
ID      Continuous Drain Current (VGS =0 , Tcase = 100)
IDM    Pulsed Drain Current 1
PD     Power Dissipation @ Tcase = 25
         Linear Derating Factor
EAS   Single Pulse Avalanche Energy 2
dv/dt Peak Diode Recovery 3
TJ , Tstg    Operating and Storage Temperature Range
TL      Package Mounting Surface Temperature (for 5 sec)
RJC  Thermal Resistance Junction to Case
RJPCB Thermal Resistance Junction to PCB (Typical)
±20V
8.0A
5.0A
32A
75W
0.6W/
500mJ
5.5V/ns
55 to 150
300
1.67/W
4/W
Notes
1) Pulse Test: Pulse Width £ 300ms, d £ 2%
2) @ VDD = 50V , L 11.7mH , RG = 25W , Peak IL = 8A , Starting TJ = 25°C
3) @ ISD 8A , di/dt 150A/ms , VDD BVDSS , TJ 150°C , SUGGESTED RG = 9.1W


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