Features: ·Avalanche Energy Rating ·Dynamic dv/dt Rating Simple ·Drive Requirements ·Ease of Paralleling ·Hermetically Sealed ·Surface Mount ·Light-weightSpecifications Parameter IRFN9240 Units ID @ VGS = -10V, TC = 25°C Continuous Drain Current -11 ...
IRFN9240: Features: ·Avalanche Energy Rating ·Dynamic dv/dt Rating Simple ·Drive Requirements ·Ease of Paralleling ·Hermetically Sealed ·Surface Mount ·Light-weightSpecifications Parameter ...
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Features: • HERMETICALLY SEALED SURFACE MOUNT PACKAGE• SMALL FOOTPRINT EFFICIENT USE ...
Parameter | IRFN9240 |
Units |
|
ID @ VGS = -10V, TC = 25°C |
Continuous Drain Current | -11 |
A |
ID @ VGS = -10V, TC = 100°C |
Continuous Drain Current | -7 |
|
IDM |
Pulsed Drain Current | -44 |
|
PD @ TC = 25°C |
Max. Power Dissipation | 125 |
W |
Linear Derating Factor | 1.0 |
W/K |
|
VGS |
Gate-to-Source Voltage | ±20 |
V |
EAS |
Single Pulse Avalanche Energy | 500 |
mJ |
IAR |
Avalanche Current | -11 |
A |
EAR |
Repetitive Avalanche Energy | 12.5 |
mJ |
dv/dt |
Peak Diode Recovery dv/dt | -5.5 |
V/ns |
TJ TSTG |
Operating Junction Storage Temperature Range |
-55 to 150 |
|
Package Mounting Surface Temperature | 300 (for 5 seconds) |
||
Weight | 2.6 (typical) |
g |
HEXFET technology IRFN9240 is the key to International Rectifier's advanced line of power MOSFET transistors. The effi- cient geometry achieves very low on-state resistance com- bined with high transconductance.
HEXFET transistors IRFN9240 also feature all of the well-establish advantages of MOSFETs, such as voltage control, very fast switching, ease of paralleling and electrical param- eter temperature stability. They are well-suited for appli- cations such as switching power supplies, motor controls, inverters, choppers, audio amplifiers, and high energy pulse circuits.
The Surface Mount Device (SMD-1) package represents another step in the continual evolution of surface mount technology. The SMD-1 IRFN9240 will give designers the extra flex- ibility they need to increase circuit board density. Inter- national Rectifier has engineered the SMD-1 package to meet the specific needs of the power market by increas- ing the size of the termination pads, thereby enhancing thermal and electrical performance.