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IRFN3710

Features: ·Surface Mount· Small Footprint· Alternative to TO-3 Package· Hermetically Sealed· Avalanche Energy Rating· Dynamic dv/dt Rating· Simple Drive Requirements· LightweightSpecifications Parameter IRFN3710 Units ID @ VGS = 10V, TC = 25°C Continuous Drain Current 4...

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SeekIC No. : 004377219 Detail

IRFN3710: Features: ·Surface Mount· Small Footprint· Alternative to TO-3 Package· Hermetically Sealed· Avalanche Energy Rating· Dynamic dv/dt Rating· Simple Drive Requirements· LightweightSpecifications ...

IRFN3710 Data Sheet

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Part Number:
IRFN3710
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

· Surface Mount
· Small Footprint
· Alternative to TO-3 Package
· Hermetically Sealed
· Avalanche Energy Rating
· Dynamic dv/dt Rating
· Simple Drive Requirements
· Lightweight


Specifications

Parameter

IRFN3710

Units

ID @ VGS = 10V, TC = 25°C

Continuous Drain Current

45

A

ID @ VGS = 10V, TC = 100°C

Continuous Drain Current

28

IDM

Pulsed Drain Current

120

PD @ TC = 25°C

Max. Power Dissipation

125

W

Linear Derating Factor

1.0

W/K

VGS

Gate-to-Source Voltage

±20

V

EAS

Single Pulse Avalanche Energy

690

mJ

IAR

Avalanche Current

27

A

EAR

Repetitive Avalanche Energy

12.5

mJ

dv/dt

Peak Diode Recovery dv/dt

5.0

V/ns

TJ
TSTG

Operating Junction
Storage Temperature Range

-55 to 150

oC

Package Mounting Surface Temperature

300 (for 5 sec.)

Weight

2.6 (typical)

9




Description

100 Volt, 0.028W, HEXFET
    Generation 5 HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area.

    This benefit IRFN3710, combined with the fast switching speed and ruggedized device IRFN3710 design for which HEXFETs are well known, provides the designer with an extremely efficient device for use in a wide variety of applications.

    The Surface Mount Device 1 (SMD-1) package represents anothther step in the continual evolution of surface mount technology. Designed to be a close replacement for the TO-3 package, the SMD-1 will give designers the extra flexibility they need to increase circuit board density. International Rectifier has engineered the SMD-1 package to meet the specific needs of the power market by increasing the size of the termination pads, thereby enhancing thermal and electical performance.




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