Features: ·Avalanche Energy Rating·Dynamic dv/dt Rating·Simple Drive Requirements·Ease of Paralleling·Hermetically Sealed·Surface Mount·Light-weightSpecifications Parameter IRFN350 Units ID @ VGS = 10V, TC = 25°C Continuous Drain Current 14 A ID @ VGS = 10V, TC ...
IRFN350: Features: ·Avalanche Energy Rating·Dynamic dv/dt Rating·Simple Drive Requirements·Ease of Paralleling·Hermetically Sealed·Surface Mount·Light-weightSpecifications Parameter IRFN350 ...
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Features: • HERMETICALLY SEALED SURFACE MOUNT PACKAGE• SMALL FOOTPRINT EFFICIENT USE ...
|
Parameter |
IRFN350 |
Units |
ID @ VGS = 10V, TC = 25°C |
Continuous Drain Current |
14 |
A |
ID @ VGS = 10V, TC = 100°C |
Continuous Drain Current |
9 | |
IDM |
Pulsed Drain Current |
56 | |
PD @ TC = 25°C |
Max. Power Dissipation |
150 |
W |
|
Linear Derating Factor |
1.2 |
W/K |
VGS |
Gate-to-Source Voltage |
±20 |
V |
EAS |
Single Pulse Avalanche Energy |
700 |
mJ |
IAR |
Avalanche Current |
14 |
A |
EAR |
Repetitive Avalanche Energy |
15 |
mJ |
dv/dt |
Peak Diode Recovery dv/dt |
4.0 |
V/ns |
TJ |
Operating Junction |
-55 to 150 |
oC |
|
Package Mounting Surface Temperature |
300 (for 5 seconds) | |
|
Weight |
2.6 (typical) |
9 |
400 Volt, 0.315W HEXFET
HEXFET technology IRFN350 is the key to International Rectifier's advanced line of power MOSFET transistors. The efficient
geometry achieves very low on-state resistance combined with high transconductance.
HEXFET transistors IRFN350 also feature all of the well-establish advantages of MOSFETs, such as voltage control, very fast switching, ease of paralleling and electrical parameter temperature stability. They are well-suited for applications such as switching power supplies, motor controls, nverters, choppers, audio amplifiers, and high energy pulse circuits.
The Surface Mount Device (SMD-1) IRFN350 package represents another step in the continual evolution of surface mount technology. The SMD-1 will give designers the extra flexibility they need to increase circuit board density. International Rectifier has engineered the SMD-1 package to meet the specific needs of the power market by increasing the size of the termination pads, thereby enhancing thermal and electrical performance.