Features: ·Avalanche Energy Rating·Dynamic dv/dt Rating·Simple Drive Requirements·Ease of Paralleling·Hermetically Sealed·Surface Mount·Light-weightSpecifications Parameter IRFN250 Units ID @ VGS = 10V, CT = 25°C Continuous Drain Curren 27.4 A ID @ VGS = 10V, TC = 100°C Continuo...
IRFN250: Features: ·Avalanche Energy Rating·Dynamic dv/dt Rating·Simple Drive Requirements·Ease of Paralleling·Hermetically Sealed·Surface Mount·Light-weightSpecifications Parameter IRFN250 Units ...
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Features: • HERMETICALLY SEALED SURFACE MOUNT PACKAGE• SMALL FOOTPRINT EFFICIENT USE ...
Parameter | IRFN250 | Units | |
ID @ VGS = 10V, CT = 25°C |
Continuous Drain Curren | 27.4 | A |
ID @ VGS = 10V, TC = 100°C |
Continuous Drain Curren | 17 | |
IDM | Pulsed Drain Current | 110 | |
PD @ TC = 25°C |
CMax. Power Dissipatio | 150 | W |
Linear Derating Factor | 1.2 | W/L | |
VGS | Gate-to-Source Voltage | ±20 | V |
EAS | Single Pulse Avalanche Energy | 500 | mJ |
IAR | Avalanche Current | 27.4 | A |
EAR | Repetitive Avalanche Energy | 15.0 | mJ |
dv/dt | Peak Diode Recovery dv/dt | 5.0 | V/ns |
TJ TSTG |
Operating Junction Storage Temperature Range |
-55 to 150 | °C |
Package Mounting Surface Temperature |
300 (for 5seconds) | ||
Weight | 2.6 (typical) | g |
HEXFET technology IRFN250 is the key to International Rectifier!advanced line of power MOSFET transistors. The effi- cient geometry achieves very low on-state resistance com-bined with high transconductance.
HEXFET transistors IRFN250 also feature all of the well-establish advantages of MOSFETs, such as voltage control, very fast switching, ease of paralleling and electrical param- eter temperature stability. They are well-suited for appli- cations such as switching power supplies, motor controls, inverters, choppers, audio amplifiers, and high energy pulse circuits.
The Surface Mount Device (SMD-1) IRFN250 package represents another step in the continual evolution of surface mount technology. The SMD-1 will give designers the extra flex-ibility they need to increase circuit board density. Inter-national Rectifier has engineered the SMD-1 package to meet the specific needs of the power market by increas- ing the size of the termination pads, thereby enhancing thermal and electrical performance.