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IRFN150SMD

Features: • HERMETICALLY SEALED SURFACE MOUNT PACKAGE• SMALL FOOTPRINT EFFICIENT USE OF PCB SPACE.• SIMPLE DRIVE REQUIREMENTS• LIGHTWEIGHT• HIGH PACKING DENSITIESSpecifications VGSIDIDIDMPDEASdv/dtTJ , TstgTLRqJCRqJPCB Gate Source VoltageContinuous Drain Curre...

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SeekIC No. : 004377210 Detail

IRFN150SMD: Features: • HERMETICALLY SEALED SURFACE MOUNT PACKAGE• SMALL FOOTPRINT EFFICIENT USE OF PCB SPACE.• SIMPLE DRIVE REQUIREMENTS• LIGHTWEIGHT• HIGH PACKING DENSITIESSpeci...

IRFN150SMD Data Sheet

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Part Number:
IRFN150SMD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

• HERMETICALLY SEALED SURFACE MOUNT PACKAGE
• SMALL FOOTPRINT EFFICIENT USE OF PCB SPACE.
• SIMPLE DRIVE REQUIREMENTS
• LIGHTWEIGHT
• HIGH PACKING DENSITIES


Specifications

VGS
ID
ID
IDM
PD
EAS
dv/dt
TJ , Tstg
TL
RqJC
RqJPCB		 Gate Source Voltage
Continuous Drain Current (VGS = 0 , Tcase = 25°C)
Continuous Drain Current (VGS = 0 , Tcase = 100°
Pulsed Drain Current 1
Power Dissipation @ Tcase = 25°C
Linear Derating Factor
Single Pulse Avalanche Energy 2
Peak Diode Recovery 3
Operating and Storage Temperature Range
Package Mounting Surface Temperature (for 5 sec)
Thermal Resistance Junction to Case
Thermal Resistance Junction to PCB (Typical)		 ±20V
27A
19A
108A
100W
0.8W/°C
150mJ
5.5V/ns
55 to 150°C
300°C
1.25°C/W
3°C/W



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