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IRFN054SMD

Features: • HERMETICALLY SEALED SURFACE MOUNT PACKAGE• SMALL FOOTPRINT EFFICIENT USE OF PCB SPACE.• SIMPLE DRIVE REQUIREMENTS• LIGHTWEIGHT• HIGH PACKING DENSITIESSpecificationsVGS Gate Source Voltage±20VID Continuous Drain Current (VGS = 0 , Tcase = 25°C) 45AID Co...

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SeekIC No. : 004377207 Detail

IRFN054SMD: Features: • HERMETICALLY SEALED SURFACE MOUNT PACKAGE• SMALL FOOTPRINT EFFICIENT USE OF PCB SPACE.• SIMPLE DRIVE REQUIREMENTS• LIGHTWEIGHT• HIGH PACKING DENSITIESSpeci...

IRFN054SMD Data Sheet

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Part Number:
IRFN054SMD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/23

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Product Details

Description



Features:

• HERMETICALLY SEALED SURFACE MOUNT PACKAGE
• SMALL FOOTPRINT EFFICIENT USE OF PCB SPACE.
• SIMPLE DRIVE REQUIREMENTS
• LIGHTWEIGHT
• HIGH PACKING DENSITIES




Specifications

VGS         Gate Source Voltage                                                          ±20V
ID            Continuous Drain Current (VGS = 0 , Tcase = 25°C)              45A
ID            Continuous Drain Current (VGS = 0 , Tcase = 100°C)            28A
IDM          Pulsed Drain Current 1                                                         180A
PD            Power Dissipation @ Tcase = 25°C                                       100W
                Linear Derating Factor                                                          0.8W/°C
EAS          Single Pulse Avalanche Energy 2                                           480mJ
dv/dt        Peak Diode Recovery 3                                                          4.5V/ns
TJ , Tstg   Operating and Storage Temperature Range                          55 to 150°C
TL             Package Mounting Surface Temperature (for 5 sec)              300°C
RJC         Thermal Resistance Junction to Case                                    1.25°C/W
RJPCB   Thermal Resistance Junction to PCB (Typical)                         3°C/W










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