IRFL214

MOSFET N-Chan 250V 0.79 Amp

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IRFL214 Picture
SeekIC No. : 00158905 Detail

IRFL214: MOSFET N-Chan 250V 0.79 Amp

floor Price/Ceiling Price

US $ 1.04~1.06 / Piece | Get Latest Price
Part Number:
IRFL214
Mfg:
Vishay/Siliconix
Supply Ability:
5000

Price Break

  • Qty
  • 0~3010
  • 3010~4000
  • Unit Price
  • $1.06
  • $1.04
  • Processing time
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 250 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 0.79 A
Resistance Drain-Source RDS (on) : 2 Ohms Configuration : Single Dual Drain
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : SOT-223 Packaging : Tube    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Mounting Style : SMD/SMT
Maximum Operating Temperature : + 150 C
Packaging : Tube
Drain-Source Breakdown Voltage : 250 V
Package / Case : SOT-223
Configuration : Single Dual Drain
Resistance Drain-Source RDS (on) : 2 Ohms
Continuous Drain Current : 0.79 A


Features:

• Surface Mount
• Available in Tape and Reel
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Fast Switching
• Ease of Paralleling
• Simple Drive Requirements
• Lead (Pb)-free Available



Specifications

PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage VDS 250 V
Gate-Source Voltage VGS ± 20
Continuous Drain Current VGS at 10 V TC = 25 °C ID 0.79 A
TC = 100 °C 0.50
Pulsed Drain Currenta IDM 6.3
Linear Derating Factor   0.025 W/
Linear Derating Factor (PCB Mount)e   0.017 W/
Single Pulse Avalanche Energyb EAS 50 mJ
Repetitive Avalanche Currenta IAR 0.79 A
Repetitive Avalanche Energya EAR 0.31 mJ
Maximum Power Dissipation (PCB Mount)e TA = 25 °C PD 3.1 W
Maximum Power Dissipation TC = 25 °C 2.0 W
* Pb containing terminations are not RoHS compliant, exemptions may apply


Description

Third generation Power MOSFETs of the IRFL214 from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The SOT-223 package of the IRFL214 is designed for surface-mounting using vapor phase, infrared, or wave soldering techniques. Its unique package design allows for easy automatic pick-and-place as with other SOT or SOIC packages but has the added advantage of improved thermal performace due to an enlarged tab for heatsinking. Power dissipation of greater than 1.25 W is possible in a typical surface mount application.




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