Features: Surface MountSmall Footprint Alternative to TO-39 PackageHermetically Sealed Dynamic dv/dt Rating Avalanche Energy RatingSimple Drive RequirementsLight WeightSpecifications Parameter IRFE310,JANTX-,JANTXV2N6786U Units Continuous Drain Current ID @ VGS = 10V, TC ...
IRFE120: Features: Surface MountSmall Footprint Alternative to TO-39 PackageHermetically Sealed Dynamic dv/dt Rating Avalanche Energy RatingSimple Drive RequirementsLight WeightSpecifications Paramete...
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Parameter |
IRFE310,JANTX-,JANTXV2N6786U |
Units | |
Continuous Drain Current |
ID @ VGS = 10V, TC = 25°C |
4.5 |
V
|
Continuous Drain Current |
ID @ VGS = 10V, TC = 100°C |
3.0 | |
Pulsed Drain Current Å |
IDM |
18 | |
Max. Power Dissipation |
PD @ TC = 25°±25 |
14 |
WmA |
Linear Derating Factor |
0.11 |
W/°C | |
Gate-to-Source Voltage |
VGS |
±20 |
V |
Single Pulse Avalanche Energy Ç |
EAS |
7.0 |
mJmW |
Surface Temperature |
EAR |
300 (for 5 S) stg |
V/ns°C |
Pckg. Mounting Surface Temp. |
dv/dt |
5.5 |
V/ns |
Operating Junction Storage Temperature Range |
TJ TSTG |
-55 to 150 |
o C |
Avalanche Current ➀ |
300 (for 5 S) | ||
Repetitive Avalanche Energy ➀ |
0.42(typical) |
g |
The leadless chip carrier (LCC) package IRFE120 represents the logical next step in the continual evolution of surface mount technology. Desinged to be a close replacement for the TO-39 package, the LCC will give designers the extra flexibility they need to increase circuit board density. International Rectifier has engineered the LCC package to meet the specific needs of the power market by increasing the size of the bottom source pad, thereby enhancing the thermal and electrical performance. The lid of the package IRFE120 is grounded to the source to reduce RF interference.