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IRFE110

Features: ! Surface Mount! Small Footprint! Alternative to TO-39 Package! Hermetically Sealed! Dynamic dv/dt Rating! Avalanche Energy Rating! Simple Drive Requirements! Light WeightSpecifications Parameter IRFE310,JANTX-,JANTXV2N6786U Units Continuous Drain Current ID @ V...

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SeekIC No. : 004377038 Detail

IRFE110: Features: ! Surface Mount! Small Footprint! Alternative to TO-39 Package! Hermetically Sealed! Dynamic dv/dt Rating! Avalanche Energy Rating! Simple Drive Requirements! Light WeightSpecifications ...

IRFE110 Data Sheet

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Part Number:
IRFE110
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/29

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Product Details

Description



Features:

! Surface Mount
! Small Footprint
! Alternative to TO-39 Package
! Hermetically Sealed
! Dynamic dv/dt Rating
! Avalanche Energy Rating
! Simple Drive Requirements
! Light Weight


Specifications

Parameter
IRFE310,JANTX-,JANTXV2N6786U
Units
Continuous Drain Current
ID @ VGS = 10V, TC = 25°C
3.5
V
Continuous Drain Current
ID @ VGS = 10V, TC = 100°C
2.25
Pulsed Drain Current Å
IDM
14
Max. Power Dissipation
PD @ TC = 25°±25
15
WmA
Linear Derating Factor
1.09
W/°C
Gate-to-Source Voltage
VGS
±20
V
Single Pulse Avalanche Energy Ç
EAS
7.0
mJmW
Surface Temperature
dv/dt
300 (for 5 S) stg
V/ns°C
Weight

0.42(typical)
g



Description

The leadless chip carrier (LCC) IRFE110 package represents the logical next step in the continual evolution of surface mount technology. Desinged to be a close replacement for the TO-39 package, the LCC will give designers the extra flexibility they need to increase circuit board density. International Rectifier has engineered the LCC package to meet the specific needs of the power market by increasing the size of the bottom source pad, thereby enhancing the thermal and electrical performance. The lid of the package IRFE110 is grounded to the source to reduce RF interference.




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