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IRF6644PbF

Features: ` RoHS Compliant` Lead-Free (Qualified up to 260°C Reflow)` Application Specific MOSFETs` Ideal for High Performance Isolated Converter Primary Switch Socket` Optimized for Synchronous Rectification` Low Conduction Losses` High Cdv/dt Immunity` Low Profile (<0.7mm)` Dual Sided Cooling...

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SeekIC No. : 004376640 Detail

IRF6644PbF: Features: ` RoHS Compliant` Lead-Free (Qualified up to 260°C Reflow)` Application Specific MOSFETs` Ideal for High Performance Isolated Converter Primary Switch Socket` Optimized for Synchronous Rec...

IRF6644PbF Data Sheet

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Part Number:
IRF6644PbF
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/6/9

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Product Details

Description



Features:

` RoHS Compliant
` Lead-Free (Qualified up to 260°C Reflow)
` Application Specific MOSFETs
` Ideal for High Performance Isolated Converter Primary Switch Socket
` Optimized for Synchronous Rectification
` Low Conduction Losses
` High Cdv/dt Immunity
` Low Profile (<0.7mm)
` Dual Sided Cooling Compatible `
` Compatible with existing Surface Mount Techniques


Specifications

Symbol Parameter Max. Units
VDS Drain-to-Source Voltage 100 V
VGS Gate-to-Source Voltage ±20 V
ID @ TA = 25°C Continuous Drain Current, VGS @ 10V 10.3 A
ID @ TA=70°C Continuous Drain Current, VGS @ 10V 8.3 A
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 60 A
IDM Pulsed Drain Current 82 A
EAS Maximum Power Dissipation 220 mJ
IAR Maximum Power Dissipation

6.2

 A



Description

The IRF6644PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The IRF6644PbF package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.

The IRF6644PbF is optimized for primary side bridge topologies in isolated DC-DC applications, for wide range universal input Telecom applications (36V - 75V), and for secondary side synchronous rectification in regulated DC-DC topologies. The reduced total losses in the device coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability improvements, and makes this device ideal for high performance isolated DC-DC converters.




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