IRF6637

MOSFET

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IRF6637 Picture
SeekIC No. : 00158710 Detail

IRF6637: MOSFET

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US $ .8~.8 / Piece | Get Latest Price
Part Number:
IRF6637
Mfg:
International Rectifier
Supply Ability:
5000

Price Break

  • Qty
  • 0~3440
  • Unit Price
  • $.8
  • Processing time
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/11/29

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 30 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 14 A
Resistance Drain-Source RDS (on) : 7.7 m Ohms Configuration : Single Quad Drain Dual Source
Maximum Operating Temperature : + 150 C Mounting Style : Through Hole
Package / Case : Direct-FET MP Packaging : Tube    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Drain-Source Breakdown Voltage : 30 V
Mounting Style : Through Hole
Maximum Operating Temperature : + 150 C
Packaging : Tube
Continuous Drain Current : 14 A
Configuration : Single Quad Drain Dual Source
Resistance Drain-Source RDS (on) : 7.7 m Ohms
Package / Case : Direct-FET MP


Features:

` Lead and Bromide Free
` Low Profile (<0.7 mm)
` Dual Sided Cooling Compatible
` Ultra Low Package Inductance
` Optimized for High Frequency Switching
` Ideal for CPU Core DC-DC Converters
` Optimized for both Sync.FET and some Control FET application
` Low Conduction and Switching Losses
` Compatible with existing Surface Mount Techniques






Specifications

Parameter Max. Unit
VDS Drain-to-Source Voltage 30 V
VGS Gate-to-Source Voltage ±20
ID @ TA = 25°C Continuous Drain Current, VGS @ 10V 14 A
ID @ TA = 70°C Continuous Drain Current, VGS @ 10V 􀀀 11
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 59
IDM Pulsed Drain Current 110
EAS Single Pulse Avalanche Energy 31
IAR Avalanche Current 11 °C





Description

The IRF6637 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.

The IRF6637 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors operating at higher frequencies. The IRF6637 has been optimized for parameters that are critical in synchronous buck operating from 12 volt buss converters including Rds(on) and gate charge to minimize losses in the control FET socket.






Parameters:

Technical/Catalog InformationIRF6637
VendorInternational Rectifier
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET PolarityN-Channel
Drain to Source Voltage (Vdss)30V
Current - Continuous Drain (Id) @ 25° C14A
Rds On (Max) @ Id, Vgs7.7 mOhm @ 14A, 10V
Input Capacitance (Ciss) @ Vds 1330pF @ 15V
Power - Max2.3W
PackagingTape & Reel (TR)
Gate Charge (Qg) @ Vgs17nC @ 4.5V
Package / CaseDirectFET? Isometric MP
FET FeatureLogic Level Gate
Drawing Number*
Lead Free StatusContains Lead
RoHS StatusRoHS Non-Compliant
Other Names IRF6637
IRF6637



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