IRF6636

MOSFET

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IRF6636 Picture
SeekIC No. : 00158644 Detail

IRF6636: MOSFET

floor Price/Ceiling Price

US $ .76~.76 / Piece | Get Latest Price
Part Number:
IRF6636
Mfg:
International Rectifier
Supply Ability:
5000

Price Break

  • Qty
  • 0~3510
  • Unit Price
  • $.76
  • Processing time
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/11/29

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 20 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 18 A
Resistance Drain-Source RDS (on) : 3.2 m Ohms Configuration : Single Quad Drain Dual Source
Maximum Operating Temperature : + 150 C Mounting Style : Through Hole
Package / Case : Direct-FET ST Packaging : Tube    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Mounting Style : Through Hole
Maximum Operating Temperature : + 150 C
Packaging : Tube
Continuous Drain Current : 18 A
Drain-Source Breakdown Voltage : 20 V
Configuration : Single Quad Drain Dual Source
Package / Case : Direct-FET ST
Resistance Drain-Source RDS (on) : 3.2 m Ohms


Features:

RoHS compliant containing no lead or bromide
Low Profile (<0.7 mm)
Dual Sided Cooling Compatible
Ultra Low Package Inductance
Optimized for High Frequency Switching
Ideal for CPU Core DC-DC Converters
Optimized for for Control FET socket of Sync. Buck Converter
Low Conduction and Switching Losses
Compatible with existing Surface Mount Techniques





Specifications

Parameter Max. Units
VDS Drain-to-Source Voltage 20 V
VGS Gate-to-Source Voltage ±20
ID@ TA= 25°C Continuous Drain Current, VGS @ 10V 18 A
ID@ TA= 25°C Continuous Drain Current, VGS @ 10V 15
ID@ TA= 25°C Continuous Drain Current, VGS @ 10V 81
IDM Pulsed Drain Current 140
EAS Single Pulse Avalanche Energy 28 mJ
IAR Avalanche Current 14 A





Description

The IRF6636 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTMpackaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allowsdual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.


The IRF6636 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors operating at higher frequencies. The IRF6636 has been optimized for parameters that are critical in synchronous buck operatingfrom 12 voltbuss converters including Rds(on) and gate charge to minimize losses in the control FET socket.






Parameters:

Technical/Catalog InformationIRF6636
VendorInternational Rectifier (VA)
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET PolarityN-Channel
Drain to Source Voltage (Vdss)20V
Current - Continuous Drain (Id) @ 25° C18A
Rds On (Max) @ Id, Vgs4.5 mOhm @ 18A, 10V
Input Capacitance (Ciss) @ Vds 2420pF @ 10V
Power - Max2.2W
PackagingCut Tape (CT)
Gate Charge (Qg) @ Vgs27nC @ 4.5V
Package / CaseDirectFET? Isometric ST
FET FeatureLogic Level Gate
Drawing Number*
Lead Free StatusContains Lead
RoHS StatusRoHS Non-Compliant
Other Names IRF6636
IRF6636
IRF6636CT ND
IRF6636CTND
IRF6636CT



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