IRF6622TRPBF

MOSFET

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SeekIC No. : 00155922 Detail

IRF6622TRPBF: MOSFET

floor Price/Ceiling Price

US $ .45~.45 / Piece | Get Latest Price
Part Number:
IRF6622TRPBF
Mfg:
International Rectifier
Supply Ability:
5000

Price Break

  • Qty
  • 0~3400
  • 3400~4800
  • Unit Price
  • $.45
  • $.45
  • Processing time
  • 15 Days
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/6/10

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 25 V
Gate-Source Breakdown Voltage : 20 V Continuous Drain Current : 15 A
Resistance Drain-Source RDS (on) : 8.9 mohms Packaging : Reel    

Description

Configuration :
Maximum Operating Temperature :
Mounting Style :
Package / Case :
Transistor Polarity : N-Channel
Drain-Source Breakdown Voltage : 25 V
Packaging : Reel
Gate-Source Breakdown Voltage : 20 V
Continuous Drain Current : 15 A
Resistance Drain-Source RDS (on) : 8.9 mohms


Features:

`RoHs Compliant
`Lead-Free (Qualified up to 260 Reflow )
`Application Specific MOSFETs
`Ideal for CPU Core DC-DC Converters
`Low Conduction Losses
`High Cdv/dt Immunity
`Low Profile (<0.7mm)
`Dual Sided Cooling Compatible 
`Compatible with existing Surface Mount Techniques 



Specifications

 
Parameter
Max.
Units
VDS Drain-to-Source Voltage
25
V
VGS Gate-to-Source Voltage
±20
ID @ TA = 25 Continuous Drain Current, VGS @ 10V
15
A
ID @ TA = 70 Continuous Drain Current, VGS @ 10V
12
ID @ TC = 25 Continuous Drain Current, VGS @ 10V
59
IDM Pulsed Drain Current
120
EAS Single Pulse Avalanche Energy
13
mJ
IAR Avalanche Current
12
A



Description

The IRF6622TRPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a Micro-8 and only 0.7 mm profile.  The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.

The IRF6622TRPbF balances industry leading on-state resistance while minimizing gate charge along with ultra low  package inductance to reduce both conduction and switching losses. The reduced losses make this product ideal for high frequency/high efficiency DC-DC convert-ers that power high current loads such as the latest generation of microprocessors. The IRF6622PbF has been optimized for parameters that are critical in synchronous buck converter's ControlFET sockets




Parameters:

Technical/Catalog InformationIRF6622TRPBF
VendorInternational Rectifier (VA)
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET PolarityN-Channel
Drain to Source Voltage (Vdss)25V
Current - Continuous Drain (Id) @ 25° C15A
Rds On (Max) @ Id, Vgs6.3 mOhm @ 15A, 10V
Input Capacitance (Ciss) @ Vds 1450pF @ 13V
Power - Max2.2W
PackagingDigi-Reel?
Gate Charge (Qg) @ Vgs17nC @ 4.5V
Package / CaseDirectFET? Isometric SQ
FET FeatureLogic Level Gate
Drawing Number*
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names IRF6622TRPBF
IRF6622TRPBF
IRF6622TRPBFDKR ND
IRF6622TRPBFDKRND
IRF6622TRPBFDKR



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