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IRF6622PbF

Features: `RoHs Compliant`Lead-Free (Qualified up to 260 Reflow )`Application Specific MOSFETs `Ideal for CPU Core DC-DC Converters `Low Conduction Losses `High Cdv/dt Immunity `Low Profile (<0.7mm) `Dual Sided Cooling Compatible`Compatible with existing Surface Mount Techniques Specifications ...

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SeekIC No. : 004376627 Detail

IRF6622PbF: Features: `RoHs Compliant`Lead-Free (Qualified up to 260 Reflow )`Application Specific MOSFETs `Ideal for CPU Core DC-DC Converters `Low Conduction Losses `High Cdv/dt Immunity `Low Profile (<0.7...

IRF6622PbF Data Sheet

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Part Number:
IRF6622PbF
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/29

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Product Details

Description



Features:

`RoHs Compliant
`Lead-Free (Qualified up to 260 Reflow )
`Application Specific MOSFETs
`Ideal for CPU Core DC-DC Converters
`Low Conduction Losses
`High Cdv/dt Immunity
`Low Profile (<0.7mm)
`Dual Sided Cooling Compatible 
`Compatible with existing Surface Mount Techniques 


Specifications

 
Parameter
Max.
Units
VDS Drain-to-Source Voltage
25
V
VGS Gate-to-Source Voltage
±20
ID @ TA = 25 Continuous Drain Current, VGS @ 10V
15
A
ID @ TA = 70 Continuous Drain Current, VGS @ 10V
12
ID @ TC = 25 Continuous Drain Current, VGS @ 10V
59
IDM Pulsed Drain Current
120
EAS Single Pulse Avalanche Energy
13
mJ
IAR Avalanche Current
12
A



Description

The IRF6622PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a Micro-8 and only 0.7 mm profile.  The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.

The IRF6622PbF balances industry leading on-state resistance while minimizing gate charge along with ultra low  package inductance to reduce both conduction and switching losses. The reduced losses make this product ideal for high frequency/high efficiency DC-DC convert-ers that power high current loads such as the latest generation of microprocessors. The IRF6622PbF has been optimized for parameters that are critical in synchronous buck converter's ControlFET sockets




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