IRF6616

MOSFET

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IRF6616 Picture
SeekIC No. : 00158581 Detail

IRF6616: MOSFET

floor Price/Ceiling Price

US $ .83~.83 / Piece | Get Latest Price
Part Number:
IRF6616
Mfg:
International Rectifier
Supply Ability:
5000

Price Break

  • Qty
  • 0~3110
  • 3110~4800
  • Unit Price
  • $.83
  • $.83
  • Processing time
  • 15 Days
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/5/28

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 100 V
Gate-Source Breakdown Voltage : +/- 30 V Continuous Drain Current : 19 A
Resistance Drain-Source RDS (on) : 5 m Ohms Configuration : Single Quad Drain Dual Source
Maximum Operating Temperature : + 150 C Mounting Style : Through Hole
Package / Case : Direct-FET MX Packaging : Reel    

Description

Transistor Polarity : N-Channel
Packaging : Reel
Drain-Source Breakdown Voltage : 100 V
Mounting Style : Through Hole
Maximum Operating Temperature : + 150 C
Gate-Source Breakdown Voltage : +/- 30 V
Continuous Drain Current : 19 A
Configuration : Single Quad Drain Dual Source
Resistance Drain-Source RDS (on) : 5 m Ohms
Package / Case : Direct-FET MX


Features:

`RoHS compliant containing no lead or bormide
`Low Profile (<0.7 mm)
`Dual Sided Cooling Compatible
`Ultra Low Package Inductance
`Optimized for High Frequency Switching
`Low Conduction and Switching Losses
`Compatible with existing Surface Mount Techniques





Specifications

Parameter
Max.
Units
VDS Drain-Source Voltage
40
V
VGS Gate-to-Source Voltage
±20
V
ID @ TA = 25 Continuous Drain Current, VGS @ 10V
19
A
ID @ TA = 70 Continuous Drain Current, VGS @ 10V
15
PD @Tc = 25 Power Dissipation (PCB Mount)
106
W
IDM Pulsed Drain Current
150
EAS Single Pulse Avalanche Energy
36
mJ
IAR Avalanche Current
15





Description

The IRF6616 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve low combined on-state and switching loss in a package that has the footprint area of an SO-8 and only 0.7mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.

The IRF6616 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors operating at higher frequencies. The IRF6616 is ideal for secondary side synchronous rectification applications up to 100W, and can also be used in some non-isolated synchronous buck applications where 30V devices do not provide enough voltage headroom.






Parameters:

Technical/Catalog InformationIRF6616
VendorInternational Rectifier
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET PolarityN-Channel
Drain to Source Voltage (Vdss)30V
Current - Continuous Drain (Id) @ 25° C19A
Rds On (Max) @ Id, Vgs5 mOhm @ 19A, 10V
Input Capacitance (Ciss) @ Vds 3765pF @ 20V
Power - Max2.8W
PackagingTape & Reel (TR)
Gate Charge (Qg) @ Vgs44nC @ 4.5V
Package / CaseDirectFET? Isometric MX
FET FeatureLogic Level Gate
Drawing Number*
Lead Free StatusContains Lead
RoHS StatusRoHS Non-Compliant
Other Names IRF6616
IRF6616



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