MOSFET
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Transistor Polarity : | N-Channel | Drain-Source Breakdown Voltage : | 40 V | ||
Gate-Source Breakdown Voltage : | +/- 20 V | Continuous Drain Current : | 23 A | ||
Resistance Drain-Source RDS (on) : | 3.4 m Ohms | Configuration : | Single Quad Drain Dual Source | ||
Maximum Operating Temperature : | + 150 C | Mounting Style : | Through Hole | ||
Package / Case : | Direct-FET MT | Packaging : | Reel |
Parameter | Max. | Units | |
VDS | Drain-to-Source Voltage | 40 | V |
VGS | Gate-to-Source Voltage | ±20 | |
ID @ TC= 25°C | Continuous Drain Current, VGS @ 10V | 150 | A |
ID @ TA= 25°C | Continuous Drain Current, VGS @ 10V | 23 | |
ID @ TA= 70°C | Continuous Drain Current, VGS @ 10V | 18 | |
IDM | Pulsed Drain Current | 180 | |
PD @ TC= 25°C | Power Dissipation | 89 | W mJ |
PD @ TA= 25°C | Power Dissipation | 2.8 | |
PD @ TA= 70°C | Power Dissipation | 1.8 | |
EAS | Single Pulse Avalanche Energy | 200 | |
IAR | Avalanche Current | 18 | A |
Linear Derating Factor | 0.022 | W/°C | |
TJ TSTG |
Operating Junction and Storage Temperature Range |
-40 to + 150 | °C |
The IRF6613 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTMpackaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package of the IRF6613 is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided
cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.
The IRF6613 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors operating at higher frequencies. The IRF6613 has been optimized for parameters that are critical in synchronous buck converters including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6613 offers particularly low Rds(on) and high Cdv/dt immunityfor synchro-nous FET applications.