IRF6613

MOSFET

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IRF6613 Picture
SeekIC No. : 00158810 Detail

IRF6613: MOSFET

floor Price/Ceiling Price

US $ 1.09~1.09 / Piece | Get Latest Price
Part Number:
IRF6613
Mfg:
International Rectifier
Supply Ability:
5000

Price Break

  • Qty
  • 0~3430
  • 3430~4800
  • Unit Price
  • $1.09
  • $1.09
  • Processing time
  • 15 Days
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/11/29

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 40 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 23 A
Resistance Drain-Source RDS (on) : 3.4 m Ohms Configuration : Single Quad Drain Dual Source
Maximum Operating Temperature : + 150 C Mounting Style : Through Hole
Package / Case : Direct-FET MT Packaging : Reel    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Packaging : Reel
Mounting Style : Through Hole
Drain-Source Breakdown Voltage : 40 V
Maximum Operating Temperature : + 150 C
Continuous Drain Current : 23 A
Configuration : Single Quad Drain Dual Source
Resistance Drain-Source RDS (on) : 3.4 m Ohms
Package / Case : Direct-FET MT


Application

Application Specific MOSFETs
Ideal for Synchronous Rectification in Isolated DC-DC Converters
Low Conduction Losses
Low Switching Losses
Low Profile (<0.7 mm)
Dual Sided Cooling Compatible
Compatible with existing Surface Mount Techniques





Specifications

Parameter Max. Units
VDS Drain-to-Source Voltage 40 V
VGS Gate-to-Source Voltage ±20
ID @ TC= 25°C Continuous Drain Current, VGS @ 10V 150 A
ID @ TA= 25°C Continuous Drain Current, VGS @ 10V 23
ID @ TA= 70°C Continuous Drain Current, VGS @ 10V 18
IDM Pulsed Drain Current 180
PD @ TC= 25°C Power Dissipation 89 W
mJ
PD @ TA= 25°C Power Dissipation 2.8
PD @ TA= 70°C Power Dissipation 1.8
EAS Single Pulse Avalanche Energy 200
IAR Avalanche Current 18 A
Linear Derating Factor 0.022 W/°C
TJ
TSTG
Operating Junction and
Storage Temperature Range
-40 to + 150 °C





Description

The IRF6613 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTMpackaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package of the IRF6613 is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided
cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.


The IRF6613 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors operating at higher frequencies. The IRF6613 has been optimized for parameters that are critical in synchronous buck converters including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6613 offers particularly low Rds(on) and high Cdv/dt immunityfor synchro-nous FET applications.






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