IRF6607

MOSFET

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IRF6607 Picture
SeekIC No. : 00158805 Detail

IRF6607: MOSFET

floor Price/Ceiling Price

US $ 1.04~1.04 / Piece | Get Latest Price
Part Number:
IRF6607
Mfg:
International Rectifier
Supply Ability:
5000

Price Break

  • Qty
  • 0~3540
  • 3540~4800
  • Unit Price
  • $1.04
  • $1.04
  • Processing time
  • 15 Days
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/5/28

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 30 V
Gate-Source Breakdown Voltage : 12 V Continuous Drain Current : 27 A
Resistance Drain-Source RDS (on) : 4.4 mOhms Configuration : Single
Maximum Operating Temperature : + 150 C Mounting Style : Through Hole
Package / Case : DirectFET MT Isometric Packaging : Reel    

Description

Transistor Polarity : N-Channel
Configuration : Single
Packaging : Reel
Drain-Source Breakdown Voltage : 30 V
Mounting Style : Through Hole
Gate-Source Breakdown Voltage : 12 V
Maximum Operating Temperature : + 150 C
Continuous Drain Current : 27 A
Resistance Drain-Source RDS (on) : 4.4 mOhms
Package / Case : DirectFET MT Isometric


Features:

· Application Specific MOSFETs
· Ideal for CPU Core DC-DC Converters
· Low Conduction Losses
· High Cdv/dt Immunity
· Low Profile (<0.7 mm)
· Dual Sided Cooling Compatible
· Compatible with existing Surface
Mount Techniques





Specifications

Parameter Max. Unit
VDS Drain-to-Source Voltage 30 V
VGS Gate-to-Source Voltage ±12
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 94 A
ID @ TA = 25°C Continuous Drain Current, VGS @ 10V 27
ID @ TA = 70°C Continuous Drain Current, VGS @ 10V 22
IDM Pulsed Drain Current 220
PD @TA = 25°C Power Dissipation 3.6 W
PD @TA = 70°C Power Dissipation 2.3
PD @TC = 25°C Power Dissipation 42
Linear Derating Factor 0.029 W/°C
TJ
TSTG
Operating Junction and
Storage Temperature Range
-40 to + 150 °C





Description

The IRF6607 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package of the IRF6607 is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and process. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.

The IRF6607 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors operating at higher frequencies. The IRF6607 has been optimized for parameters that are critical in synchronous buck converters including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6607 offers particularly low Rds(on) and high Cdv/dt immunity for synchronous FET applications






Parameters:

Technical/Catalog InformationIRF6607
VendorInternational Rectifier (VA)
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET PolarityN-Channel
Drain to Source Voltage (Vdss)30V
Current - Continuous Drain (Id) @ 25° C27A
Rds On (Max) @ Id, Vgs3.3 mOhm @ 25A, 10V
Input Capacitance (Ciss) @ Vds 6930pF @ 15V
Power - Max3.6W
PackagingCut Tape (CT)
Gate Charge (Qg) @ Vgs75nC @ 4.5V
Package / CaseDirectFET? Isometric MT
FET FeatureLogic Level Gate
Drawing Number*
Lead Free StatusContains Lead
RoHS StatusRoHS Non-Compliant
Other Names IRF6607
IRF6607
IRF6607CT ND
IRF6607CTND
IRF6607CT



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