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IRF646

Features: • 14A, 275V• rDS(ON) = 0.280• Single Pulse Avalanche Energy Rated• SOA is Power Dissipation Limited• Nanosecond Switching Speeds• Linear Transfer Characteristics• High Input Impedance• 275VDC Rating-120VAC Line System Operation• Relat...

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IRF646: Features: • 14A, 275V• rDS(ON) = 0.280• Single Pulse Avalanche Energy Rated• SOA is Power Dissipation Limited• Nanosecond Switching Speeds• Linear Transfer Charac...

IRF646 Data Sheet

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Part Number:
IRF646
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• 14A, 275V
• rDS(ON) = 0.280
• Single Pulse Avalanche Energy Rated
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedance
• 275VDC Rating-120VAC Line System Operation
• Related Literature
- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"


Specifications

IRF646 UNITS
Drain to Source Voltage (Note 1) VDS 275 V
Drain to Gate Voltage (RGS = 20k) (Note 1) VDGR 275 V
Continuous Drain Current ID 14 A
TC = 100 ID 8.8 A
Pulsed Drain Current (Note 3) IDM 56 A
Gate to Source Voltage VGS ±20 V
Maximum Power Dissipation PD 125 W
Linear Derating Factor 1.0 W/
Single Pulse Avalanche Energy Rating (Note 4) EAS 550 mJ
Operating and Storage Temperature TJ, TSTG -55 to 150
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s TL 300
Package Body for 10s, See Techbrief 334 Tpkg 260
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25to125.


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