MOSFET N-CH 200V 18A TO-262
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Series: | - | Manufacturer: | Vishay Siliconix | ||
FET Type: | MOSFET N-Channel, Metal Oxide | Transistor Type: | - | ||
Gain : | 19.5 dB | Current - Collector (Ic) (Max): | - | ||
FET Feature: | Standard | Drain to Source Voltage (Vdss): | 200V | ||
Voltage - Collector Emitter Breakdown (Max): | - | Current - Continuous Drain (Id) @ 25° C: | 18A | ||
Vce Saturation (Max) @ Ib, Ic: | - | Current - Collector Cutoff (Max): | - | ||
Rds On (Max) @ Id, Vgs: | 180 mOhm @ 11A, 10V | DC Current Gain (hFE) (Min) @ Ic, Vce: | - | ||
Vgs(th) (Max) @ Id: | 4V @ 250µA | Gate Charge (Qg) @ Vgs: | 70nC @ 10V | ||
Frequency - Transition: | - | Input Capacitance (Ciss) @ Vds: | 1300pF @ 25V | ||
Power - Max: | 130W | Mounting Type: | Through Hole | ||
Package / Case: | TO-262-3 Long Leads, I²Pak, TO-262AA | Supplier Device Package: | I2PAK |
Parameter |
Max. |
Units | |
ID @ TC = 25°C |
Continuous Drain Current, VGS @ 10V |
18 |
A |
ID @ TC = 100°C |
Continuous Drain Current, VGS @ 10V |
13 | |
IDM |
Pulsed Drain Current |
72 | |
PD @TA = 25°C |
Power Dissipation |
3.1 |
W |
PD @TC = 25°C |
Power Dissipation |
150 |
W |
Linear Derating Factor |
1.0 |
W/°C | |
VGS |
Gate-to-Source Voltage |
± 20 |
V |
EAS |
Single Pulse Avalanche Energy‚ |
247 |
mJ |
IAR |
Avalanche Current |
18 |
A |
EAR |
Repetitive Avalanche Energy |
15 |
mJ |
dv/dt |
Peak Diode Recovery dv/dt † |
8.1 |
V/ns |
TJ |
Operating Junction and |
-55 to +175 |
°C |
TSTG |
Storage Temperature Range | ||
Soldering Temperature, for 10 seconds |
300 (1.6mm from case ) |
Third Generation HEXFETs IRF640L from International Rectifier provide the designer with the best combinations of fast switching ,ruggedized device design, low on-resistance and cost-effectiveness.
The D2Pak IRF640L is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.The through-hole version (IRF640L) is available for low-profile applications.