Features: · Avalanche Rugged Technology· Rugged Gate Oxide Technology· Lower Input Capacitance· Improved Gate Charge· Extended Safe Operating Area· Lower Leakage Current : 10 A (Max.) @ VDS = 200V· Lower RDS(ON) : 0.144 (Typ.)Specifications Symbol Parameter Value Units VDSS D...
IRF640A: Features: · Avalanche Rugged Technology· Rugged Gate Oxide Technology· Lower Input Capacitance· Improved Gate Charge· Extended Safe Operating Area· Lower Leakage Current : 10 A (Max.) @ VDS = 200V· ...
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Symbol |
Parameter |
Value |
Units |
VDSS |
Drain-to-Source Voltage |
200 |
V |
ID |
Continuous Drain Current (TC=25 ) Continuous Drain Current (TC=100 ) |
18 11.4 |
A |
IDM |
Drain Current-Pulsed Gate-to-Source Voltage |
72 |
W/ |
VGS |
Gate-to-Source Voltage |
20 |
V |
EAS |
Single Pulse Avalanche Energy |
60 |
mJ |
IAR |
Avalanche Current |
12.5 |
A |
EAR |
Repetitive Avalanche Energy |
7.5 |
mJ |
dV/dt |
Peak Diode Recovery dv/dt |
4.4 |
V/ns |
PD |
Total Power Dissipation (TC=25 ) Linear Derating Factor |
139 1.11 |
W |
TJ |
Operating Junction |
-55 to 200 |
|
TSTG |
Storage Temperature Range | ||
TL |
Maximum Lead Temp. for Soldering Purposes, 1/8 " from case for 5-seconds |
300 |