Features: `Avalanche Rugged Technology`Rugged Gate Oxide Technology`Lower Input Capacitance`Improved Gate Charge`Extended Safe Operating Area`Lower Leakage Current : 10 A (Max.) @ VDS = 200V`Low RDS(ON) : 0.333 (Typ.)Specifications Symbol Parameter Value Units VDSS Drain-Source Vo...
IRF630A: Features: `Avalanche Rugged Technology`Rugged Gate Oxide Technology`Lower Input Capacitance`Improved Gate Charge`Extended Safe Operating Area`Lower Leakage Current : 10 A (Max.) @ VDS = 200V`Low RDS...
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Symbol | Parameter |
Value |
Units |
VDSS | Drain-Source Voltage |
200 |
V |
ID | Continuous Drain Current (TC=25) |
9 |
A |
Continuous Drain Current (TC=100 ) |
5.7 |
A | |
IDM | Drain Current-Pulsed |
36 |
A |
VGSS | Gate-Source Voltage |
±30 |
V |
EAS | Single Pulsed Avalanche Energy |
162 |
mJ |
IAR | Avalanche Current |
9 |
A |
EAR | Repetitive Avalanche Energy |
7.2 |
mJ |
dv/dt | Peak Diode Recovery dv/dt |
50 |
V/ns |
PD | Total Power Dissipation (TC=25 ) Linear Derating Factor |
72 0.57 |
W
W/ |
TJ,TSTG | Operating Junction and Storage Temperature Range |
- 55 to +150 |
|
TL | Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds |
300 |