IRF6150

MOSFET 2P-CH 20V 7.9A FLIP-FET

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SeekIC No. : 003430154 Detail

IRF6150: MOSFET 2P-CH 20V 7.9A FLIP-FET

floor Price/Ceiling Price

Part Number:
IRF6150
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Quick Details

Series: HEXFET® Manufacturer: International Rectifier
FET Type: 2 P-Channel (Dual) FET Feature: Standard
Drain to Source Voltage (Vdss): 20V Current - Continuous Drain (Id) @ 25° C: 7.9A
Rds On (Max) @ Id, Vgs: 36 mOhm @ 7.9A, 4.5V Vgs(th) (Max) @ Id: 1.2V @ 250µA
Gate Charge (Qg) @ Vgs: - Drain Current (Idss at Vgs=0) : 8 mA to 20 mA
Input Capacitance (Ciss) @ Vds: - Power - Max: 3W
Mounting Type: Surface Mount Package / Case: 16-FlipFet?
Supplier Device Package: 16-FlipFet?    

Description

Input Capacitance (Ciss) @ Vds: -
Mounting Type: Surface Mount
FET Type: 2 P-Channel (Dual)
Drain to Source Voltage (Vdss): 20V
FET Feature: Standard
Vgs(th) (Max) @ Id: 1.2V @ 250µA
Gate Charge (Qg) @ Vgs: -
Series: HEXFET®
Manufacturer: International Rectifier
Packaging: Cut Tape (CT)
Current - Continuous Drain (Id) @ 25° C: 7.9A
Rds On (Max) @ Id, Vgs: 36 mOhm @ 7.9A, 4.5V
Power - Max: 3W
Package / Case: 16-FlipFet?
Supplier Device Package: 16-FlipFet?


Features:

 Ultra Low RSS(on) per Footprint Area
 Low Thermal Resistance
 Bi-Directional P-Channel Switch
 Super Low Profile (<.8mm)
 Available Tested on Tape & Reel



Specifications

  Parameter Max. Units
VSS Source-to-Source Voltage -20 V
IS @ TC = 25°C Continuous Current,VGS1 = VGS2 = -4.5V ±7.9 A
IS @ TC = 70°C Continuous Current, VGS1 = VGS2 = -4.5V ±6.3
ISM Pulsed Current ±40
PD @TC = 25°C Power Dissipation 3.0 W
PD @TC = 70°C Power Dissipation 1.9
  Linear Derating Factor 24 mW/°C
VGS Gate-to-Source Voltage ±12 V
TJ.TSTG Junction and Storage Temperature Range -55 to + 150 °C



Description

True chip-scale packaging is available from International Rectifier. Through the use of advanced processing techniques of IRF6150 and a unique packaging concept, extremely low on-resistance and the highest power densities in the industry have been made available for battery and load management applications. These benefits of IRF6150, combined with the ruggedized device design that International Rectifier is well known for, provides the designer with an extremely efficient and reliable device.

The FlipFETTM package, is one-third the footprint of a comparable SO-8 package and has a profile of less than .8mm. Combined with the low thermal resistance of the die level device, IRF6150 makes the  FlipFETTM the best device for applications where printed circuit board space is at a premium and in extremely thin application environments such as battery packs, cell phones and PCMCIA cards.


Parameters:

Technical/Catalog InformationIRF6150
VendorInternational Rectifier (VA)
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET Polarity2 P-Channel (Dual)
Drain to Source Voltage (Vdss)20V
Current - Continuous Drain (Id) @ 25° C7.9A
Rds On (Max) @ Id, Vgs36 mOhm @ 7.9A, 4.5V
Input Capacitance (Ciss) @ Vds -
Power - Max3W
PackagingCut Tape (CT)
Gate Charge (Qg) @ Vgs-
Package / CaseFlipFet?-16
FET FeatureStandard
Drawing Number*
Lead Free StatusContains Lead
RoHS StatusRoHS Non-Compliant
Other Names IRF6150
IRF6150
IRF6150CT ND
IRF6150CTND
IRF6150CT



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