Features: ·Ultra Low On-Resistance·N-Channel MOSFET·Surface Mount·Available in Tape & ReelSpecifications Parameter Max. Units VDS Drain-Source Voltage 20 V ID @ TA =25 Continuous Drain Current,VGS @ 4.5V 4.2 A ID @ TA =70 Continuous Drain Current,VGS @ 4.5V 3.4 IDM...
IRF1902: Features: ·Ultra Low On-Resistance·N-Channel MOSFET·Surface Mount·Available in Tape & ReelSpecifications Parameter Max. Units VDS Drain-Source Voltage 20 V ID @ TA =25 Continu...
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Parameter | Max. | Units | |
VDS | Drain-Source Voltage | 20 | V |
ID @ TA =25 | Continuous Drain Current,VGS @ 4.5V | 4.2 | A |
ID @ TA =70 | Continuous Drain Current,VGS @ 4.5V | 3.4 | |
IDM | Pulsed Drain Current | 17 | |
PD @ TA =25 | Maximum Power Dissipation | 2.5 | W |
PD @ TA =70 | Maximum Power Dissipation | 1.6 | |
Linear Derating Factor | 0.05 | mW/ | |
VGS | Gate-to-Source Voltage | ±12 | V |
TJ TSTG |
Operating and Junction Storage Temperature Range |
-55 to + 150 |
These N-Channel HEXFET power MOSFETs of the IRF1902 from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit provides the designer with an extremely efficient device for use in battery and load management applications.
The SO-8 of the IRF1902 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infrared, or wave soldering techniques.