Features: • HERMETICALLY SEALED SURFACE MOUNT PACKAGE• SMALL FOOTPRINT EFFICIENT USE OF PCB SPACE.• SIMPLE DRIVE REQUIREMENTS• LIGHTWEIGHT• HIGH PACKING DENSITIESSpecifications VGS Gate - Source Voltag ±20 ID Continuous Drain Current(VGS = 0 , Tcase = 25 ...
IRF150SMD: Features: • HERMETICALLY SEALED SURFACE MOUNT PACKAGE• SMALL FOOTPRINT EFFICIENT USE OF PCB SPACE.• SIMPLE DRIVE REQUIREMENTS• LIGHTWEIGHT• HIGH PACKING DENSITIESSpeci...
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VGS | Gate - Source Voltag | ±20 |
ID | Continuous Drain Current(VGS = 0 , Tcase = 25 |
27A |
ID | Continuous Drain Current(VGS = 0 , Tcase = 100 | 19A |
IDM | PulsedDrain Current 1 | 108A |
PD | Power Dissipation @ Tcase = 25 |
100W |
Linear Derating Factor | 0.8W/ | |
EAS | Single Pulse Avalanche Energy 2 | 150mJ |
dv/dt | Peak Diode Recovery 3 | 5.5V/ns |
TJ , Tstg | Operating and Storage Temperature Range | -55 to 150 |
TL | Package Mounting Surface Temperature (for5 sec) | 300 |
RJC | Thermal Resistance Junction to Case | 1.25/W |
RJ-PCB | Thermal Resistance Junction to PCB (Typical) | 3/W |