Features: • Single Pulsed RAS Interface• Fully Synchronous to Positive Clock Edge• 0 to 70 °C operating temperature• Four Banks controlled by BA0 & BA1• Programmable CAS Latency: 2, 3• Programmable Wrap Sequence: Sequential or Interleave• Programmable ...
HYB 39S128160CT(L): Features: • Single Pulsed RAS Interface• Fully Synchronous to Positive Clock Edge• 0 to 70 °C operating temperature• Four Banks controlled by BA0 & BA1• Programmabl...
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Pinout<IMG src= /uploadfile/ic-data/20081229221916883.jpg border=0>SpecificationsOperating ...
Pinout<IMG src= /uploadfile/ic-data/20081229221916883.jpg border=0>SpecificationsOperating ...
Pinout<IMG src= /uploadfile/ic-data/20081229221916883.jpg border=0>SpecificationsOperating ...
The HYB 39S128400/800/HYB 39S128160CT(L) are four bank Synchronous DRAM's organized as 4 banks * 8MBit x4, 4 banks * 4MBit x8 and 4 banks * 2Mbit x16 respectively. These synchronous devices achieve high speed data transfer rates by employing a chip architecture that prefetches multiple bits and then synchronizes the output data to a system clock. The chip is fabricated using the Infineon advanced 0.17 micron process technology.
The device HYB 39S128160CT(L) is designed to comply with all industry standards set for synchronous DRAM products, both electrically and mechanically. All of the control, address, data input and output circuits are synchronized with the positive edge of an externally supplied clock.
Operating the four memory banks in an interleave fashion allows random access operation to occur at a higher rate than is possible with standard DRAMs. A sequential and gapless data rate is possible depending on burst length, CAS latency and speed grade of the device HYB 39S128160CT(L).
Auto Refresh (CBR) and Self Refresh operation are supported. These devices HYB 39S128160CT(L) operate with a single 3.3 V ± 0.3 V power supply and are available in TSOPII packages.