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HY51V18163HG

Features: • Extended Data Out Mode capability• Read-modify-write capability• Multi-bit parallel test capability• TTL(3.3V) compatible inputs and outputs• /RAS only, CAS-before-/RAS, Hidden and self refresh(L-version) capability• JEDEC standard pinout• 42pi...

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SeekIC No. : 004368213 Detail

HY51V18163HG: Features: • Extended Data Out Mode capability• Read-modify-write capability• Multi-bit parallel test capability• TTL(3.3V) compatible inputs and outputs• /RAS only, CAS...

HY51V18163HG Data Sheet

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Part Number:
HY51V18163HG
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/3/13

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Product Details

Description



Features:

• Extended Data Out Mode capability
• Read-modify-write capability
• Multi-bit parallel test capability
• TTL(3.3V) compatible inputs and outputs
• /RAS only, CAS-before-/RAS, Hidden and self refresh(L-version) capability
• JEDEC standard pinout
• 42pin plastic SOJ / 44(50)pin TSOP-II (400mil)
• Single power supply of 3.3V +/- 0.3V
• Battery back up operation(L-version)
• 2CAS byte control


Pinout

Connection Diagram


Specifications

Parameter
Symbol
Rating
Unit
Ambient Temperature
TA
0 ~ 70
Storage Temperature
TSG
-55 ~ 125
Voltage on Any Pin relative to VSS
VT
-0.5 ~ Vcc + 0.5
(Max 4.6V)
V
Voltage on VDD relative to VSS
VCC
-0.5 ~ 4.6
V
Short Circuit Output Current
IOUT
50
mA
Power Dissipation
PT
1
W
Note : Operation at or above absolute Maximum Ratings can adversely affect device reliability


Description

The HY51V18163HG is the new generation dynamic RAM organized 1,048,576 words x 16bit. HY51V(S)18163HG/HGL has realized higher density, higher performance and various functions by utilizing advanced CMOS process technology. The HY51V(S)18163HG/HGL offers Extended Data Out Page- Mode as a high speed access mode. Multiplexed address inputs permit the HY51V18163HG to be packaged in standard 400mil 42pin SOJ and 44(50) pin TSOP-II. The package size provides high system bit densities and is compatible with widely available automated testing and insertion equipment.




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