Features: • High capacitance ratio. (n = 2.35 min)• Low series resistance. (rs = 0.60 max)• Thin Extremely small Flat Package (TEFP) is suitable for surface mount design.SpecificationsReverse voltage VR..................... 15 VJunction temperature Tj ...............125 °CStorag...
HVL355CM: Features: • High capacitance ratio. (n = 2.35 min)• Low series resistance. (rs = 0.60 max)• Thin Extremely small Flat Package (TEFP) is suitable for surface mount design.Specifica...
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