HVB190S

Features: • Low capacitance. (C = 0.35 pF max)• Low forward resistance. (rf = 3.0 Ω typ)• CMPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item SYMBOL RATING UNIT Reverse Voltage VR 50 V Forward curren...

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HVB190S Picture
SeekIC No. : 004367688 Detail

HVB190S: Features: • Low capacitance. (C = 0.35 pF max)• Low forward resistance. (rf = 3.0 Ω typ)• CMPAK package is suitable for high density surface mounting and high speed assembly....

floor Price/Ceiling Price

Part Number:
HVB190S
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/18

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Product Details

Description



Features:

• Low capacitance. (C = 0.35 pF max)
• Low forward resistance. (rf = 3.0 Ω typ)
• CMPAK package is suitable for high density surface mounting and high speed assembly.



Pinout

  Connection Diagram


Specifications

Item SYMBOL RATING UNIT
Reverse Voltage VR 50 V
Forward current IF 50 mA
Power dissipation Pd 100 mW
Junction Temperature TJ 125
Storage Temperature Tstg -55~+125



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