HVB187YP

Features: • Low forward resistance. (rf = 5.5 max)• CMPAK-4 package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Reverse voltage VR 60 V Forward current IF 50 mA Power dissi...

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HVB187YP Picture
SeekIC No. : 004367687 Detail

HVB187YP: Features: • Low forward resistance. (rf = 5.5 max)• CMPAK-4 package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol V...

floor Price/Ceiling Price

Part Number:
HVB187YP
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/18

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Product Details

Description



Features:

• Low forward resistance. (rf = 5.5 max)
• CMPAK-4 package is suitable for high density surface mounting and high speed assembly.



Pinout

  Connection Diagram


Specifications

Item
Symbol
Value
Unit
Reverse voltage
VR
60
V
Forward current
IF
50
mA
Power dissipation
Pd*1
100
mW
Junction temperature
Tj
125
Storage temperature
Tstg
-55 to +125
Note: 1. Per one device.


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