SeekIC No. : 004366153
Detail
HSM2694: Features: · Low forward resistance. (rf = 0.9 max)· Low capacitance. (C = 1.2pFmax)· MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications ...
HSM2694 Data Sheetfloor Price/Ceiling Price
- Part Number:
- HSM2694
- Supply Ability:
- 5000
Price Break
- Qty
- 1~5000
- Unit Price
- Negotiable
- Processing time
- 15 Days
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Month Sales
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Payment Methods
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